Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPT | P10636 | 1/20 | 0.63 |
| ▸ | TSHR | P16473 | 4/20 | 0.55 |
| ▸ | LMNA | P02545 | 2/20 | 0.55 |
| ▸ | NFKB1 | P19838 | 1/20 | 0.55 |
| ▸ | PMP22 | Q01453 | 1/20 | 0.55 |
| ▸ | GSTK1 | Q9Y2Q3 | 2/20 | 0.50 |
| ▸ | FFAR4 | Q5NUL3 | 3/20 | 0.48 |
| ▸ | FFAR1 | O14842 | 3/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.47 |
| ▸ | GPR84 | Q9NQS5 | 4/20 | 0.46 |
| ▸ | ENPEP | Q07075 | 1/20 | 0.45 |
| ▸ | PPARG | P37231 | 4/20 | 0.44 |
| ▸ | PPARD | Q03181 | 4/20 | 0.44 |
| ▸ | PPARA | Q07869 | 4/20 | 0.44 |
| ▸ | HDAC11 | Q96DB2 | 3/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.44 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.44 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.44 |
| ▸ | TLR2 | O60603 | 1/20 | 0.44 |
| ▸ | MEN1 | O00255 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8639483 | 1.00 | MAPT (0.63) | MAPTTSHRLMNANFKB1PMP22 | |
| SCHEMBL22826568 | 0.98 | MAPT (0.59) | MAPTTSHRLMNANFKB1PMP22 | |
| SCHEMBL18334377 | 0.91 | MAPT (0.56) | MAPTTSHRLMNANFKB1PMP22 | |
| SCHEMBL18334378 | 0.91 | MAPT (0.56) | MAPTTSHRLMNANFKB1PMP22 | |
| SCHEMBL9620798 | 0.88 | MAPT (0.77) | MAPTGSTK1FFAR1GPR84PPARD | |
| SCHEMBL9621069 | 0.88 | MAPT (0.77) | MAPTGSTK1FFAR1GPR84PPARD | |
| SCHEMBL9620494 | 0.88 | MAPT (0.77) | MAPTGSTK1FFAR1GPR84PPARD | |
| SCHEMBL9620682 | 0.88 | MAPT (0.77) | MAPTGSTK1FFAR1GPR84PPARD | |
| SCHEMBL9620776 | 0.85 | MAPT (0.73) | MAPTFFAR1GPR84PPARDTDP1 | |
| SCHEMBL21895805 | 0.81 | TSHR (0.60) | TSHRLMNANFKB1PMP22GSTK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2025013517-A1 | RESIN COMPOSITION, CURED PRODUCT, LAMINATE, AND METHOD FOR PRODUCING CURED PRODUCT | 富士フイルム株式会社 | 2025-01-16 | — | — | WO | disclosed |
| WO-2024203222-A1 | RESIN COMPOSITION, METHOD FOR PRODUCING INTERLAYER INSULATING FILM FOR REWIRING LAYER, AND PHOTOSENSITIVE AGENT | 富士フイルム株式会社 | 2024-10-03 | — | — | WO | disclosed |
| WO-2024195608-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, MULTILAYER BODY, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING MULTILAYER BODY, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-09-26 | — | — | WO | disclosed |
| WO-2024190733-A1 | PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2024-09-19 | — | — | WO | disclosed |
| WO-2024143211-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143210-A1 | MEMBER, METHOD FOR MANUFACTURING MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, AND SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024070963-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | 富士フイルム株式会社 | 2024-04-04 | — | — | WO | disclosed |