SCHEMBL30833194

SCHEMBL30833194

Nc1ccc(C(=O)O)c(CCCCCCc2cc(N)ccc2C(=O)O)c1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.53
ALDH1A1 P00352 4/20 0.53
KDM4E B2RXH2 3/20 0.53
CYP3A4 P08684 2/20 0.53
GAA P10253 1/20 0.53
ESR2 Q92731 1/20 0.53
PTPN1 P18031 1/20 0.53
TDP1 Q9NUW8 3/20 0.48
MEN1 O00255 2/20 0.48
THRB P10828 2/20 0.48
RECQL P46063 2/20 0.48
KMT2A Q03164 2/20 0.48
USP2 O75604 1/20 0.48
POLB P06746 1/20 0.48
PKM P14618 1/20 0.48
APEX1 P27695 1/20 0.48
BLM P54132 1/20 0.48
MCL1 Q07820 1/20 0.48
TNF P01375 1/20 0.48
HSPD1 P10809 1/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29632107 0.98 ALDH1A1 (0.55) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL343331 0.98 ALDH1A1 (0.55) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL29632227 0.94 ALDH1A1 (0.55) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL308882 0.94 ALDH1A1 (0.55) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL6112733 0.92 PPARA (0.54) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL9068780 0.92 PPARA (0.54) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL4327627 0.92 PPARA (0.54) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL9068637 0.92 PPARA (0.54) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL19678704 0.91 ALDH1A1 (0.49) MAPTALDH1A1KDM4ECYP3A4GAA
SCHEMBL28062236 0.90 ALDH1A1 (0.59) MAPTALDH1A1KDM4ECYP3A4GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119866354-A Polyimide resin, polyimide varnish, polyimide film and temporary fixing material composition 三菱瓦斯化学株式会社 2025-04-22 CN disclosed
WO-2024058061-A1 POLYIMIDE RESIN, POLYIMIDE VARNISH, POLYIMIDE FILM, AND TEMPORARY FIXING MATERIAL COMPOSITION 三菱瓦斯化学株式会社 2024-03-21 WO disclosed