SCHEMBL308453

SCHEMBL308453

[CH2]CNC[CH2]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2539755 0.78
SCHEMBL2537546 0.75 LMNA (0.38)
SCHEMBL21694480 0.75 LMNA (0.38)
SCHEMBL3642431 0.71
SCHEMBL1235474 0.71
SCHEMBL2053803 0.69
SCHEMBL9194291 0.66
SCHEMBL197415 0.66
SCHEMBL1229906 0.66
SCHEMBL2196717 0.66

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 322 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230312975-A1 FLOOR PROTECTION SYSTEM WITH HIGH DYNAMIC CRACK BRIDGING SIKA TECHNOLOGY AG (CH) 2023-10-05 US claimed
EP-4240799-A1 FLOOR PROTECTION SYSTEM WITH HIGH DYNAMIC CRACK BRIDGING Sika Technology AG (CH) 2023-09-13 EP claimed
CN-116472318-A Ground protection system with high dynamic fracture bridging SIKA技术股份公司 2023-07-21 CN claimed
CN-110312748-B Curing agents for low emission epoxy resin compositions SIKA技术股份公司 2023-01-06 CN claimed
EP-3995549-A1 SOIL PROTECTION SYSTEM WITH HIGH DYNAMIC CRACK BRIDGING Sika Technology AG (CH) 2022-05-11 EP claimed
US-20220033568-A1 CURING AGENT FOR EPOXY RESIN ADHESIVES SIKA TECHNOLOGY AG (CH) 2022-02-03 US claimed
EP-3861048-A1 HARDENER FOR EPOXY-RESIN ADHESIVES Sika Technology AG (CH) 2021-08-11 EP claimed
US-11053347-B2 Curing agent for low-emission epoxy resin compositions SIKA TECHNOLOGY AG (CH) 2021-07-06 US claimed
CN-112789309-A Curing agent for epoxy resin adhesive SIKA技术股份公司 2021-05-11 CN claimed
EP-3596151-B1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-28 EP claimed
EP-0610334-B1 NONPEPTIDYL INTEGRIN INHIBITORS HAVING SPECIFICITY FOR THE GPII B III A RECEPTOR GENENTECH INC (US) 1996-01-24 EP claimed
US-5403836-A Anticoagulants GENENTECH, INC. (US) 1995-04-04 US claimed
WO-1995004057-A1 TRICYCLIC INHIBITORS OF THE GPIIbIIIa RECEPTOR GENENTECH, INC. (US) 1995-02-09 WO claimed
EP-0610334-A1 NONPEPTIDYL INTEGRIN INHIBITORS HAVING SPECIFICITY FOR THE GPII b?III a? RECEPTOR. GENENTECH INC (US) 1994-08-17 EP claimed
US-5215988-A Treating angina, hypertension, arrhythmia, cerebral vascular insufficiency SANOFI (FR) 1993-06-01 US claimed
WO-1993008174-A1 NONPEPTIDYL INTEGRIN INHIBITORS HAVING SPECIFICITY FOR THE GPIIbIIIa RECEPTOR GENENTECH, INC. (US) 1993-04-29 WO claimed
EP-0235111-B1 INDOLIZINE DERIVATIVES, PROCESS FOR THEIR PREPARATION AND COMPOSITIONS CONTAINING THEM SANOFI S.A. (FR) 1991-04-10 EP claimed
US-4957925-A HYPOTENSIVE AGENTS, ANTIARRHYTHMIA AGENTS, TREATMENT OF ANGINA SANOFI (FR) 1990-09-18 US claimed
US-4616002-A HYPOTENSIVE AGENTS CIBA-GEIGY CORPORATION (US) 1986-10-07 US claimed
EP-0145956-A1 Composés amidés CIBA-GEIGY AG (CH) 1985-06-26 EP claimed