SCHEMBL30894533

SCHEMBL30894533

CC1(C)CC(OC(=O)CCCCCCCCC(=O)OC2CC(C)(C)N(OC3CCCC3)C(C)(C)C2)CC(C)(C)N1OC1CCCC1

nearest known ligand 0.55

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 2/20 0.55
SMN1; SMN2 Q16637 1/20 0.47
KMT2A Q03164 2/20 0.39
MEN1 O00255 1/20 0.39
GAA P10253 1/20 0.39
EPHX2 P34913 2/20 0.35
CYP2C19 P33261 1/20 0.35
TSHR P16473 3/20 0.34
ALDH1A1 P00352 3/20 0.33
HTT P42858 1/20 0.33
ESR1 P03372 1/20 0.33
HSD17B10 Q99714 1/20 0.33
USP2 O75604 1/20 0.33
ALOX15 P16050 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
TP53 P04637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL698203 0.99 NAAA (0.56) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL10467609 0.99 NAAA (0.56) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL30894534 0.99 NAAA (0.56) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL9743615 0.99 NAAA (0.56) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL453206 0.97 NAAA (0.54) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL20194432 0.94 NAAA (0.66) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL1232050 0.94 NAAA (0.66) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL1938967 0.94 NAAA (0.51) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL27477147 0.92 NAAA (0.49) NAAASMN1; SMN2KMT2AMEN1GAA
SCHEMBL9371596 0.91 NAAA (0.49) NAAASMN1; SMN2KMT2AMEN1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240110003-A1 FLAME RETARDANT COMPOSITIONS CONTAINING POLYCYCLIC-OLEFINIC POLYMER WITH OLEFINIC FUNCTIONALITY FOR FORMING LOW-LOSS FILMS HAVING IMPROVED DIELECTRIC AND THERMAL PROPERTIES PROMERUS, LLC (US) 2024-04-04 US disclosed