Tert-Butyl Hydroperoxide

Tert-Butyl Hydroperoxide

SCHEMBL309338

CC(C)(C)OO.c1ccccc1

nearest known ligand 0.75

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Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.75
ALOX15 P16050 1/20 0.48
TSHR P16473 3/20 0.33
TDP1 Q9NUW8 2/20 0.33
HSD17B10 Q99714 1/20 0.33
MAPK1 P28482 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Tert-Butyl Hydroperoxide SCHEMBL3309161 0.91
Tert-Butyl Hydroperoxide SCHEMBL20212 0.87
Tert-Butyl Hydroperoxide SCHEMBL8377296 0.87 ALDH1A1 (1.00) ALDH1A1ALOX15TSHRTDP1MAPK1
Tert-Butyl Hydroperoxide SCHEMBL27265845 0.87 ALDH1A1 (0.56) ALDH1A1ALOX15TSHRTDP1HSD17B10
Tert-Butyl Hydroperoxide SCHEMBL788774 0.87 ALDH1A1 (1.00) ALDH1A1ALOX15TSHRTDP1MAPK1
Tert-Butyl Hydroperoxide SCHEMBL28168079 0.84 ALDH1A1 (0.53) ALDH1A1ALOX15TSHRTDP1HSD17B10
Tert-Butyl Hydroperoxide SCHEMBL5066592 0.82
Tert-Butyl Hydroperoxide SCHEMBL11312019 0.82
Tert-Butyl Hydroperoxide SCHEMBL11022695 0.82
Tert-Butyl Hydroperoxide SCHEMBL3026364 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 562 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110343301-A Rubber composition for tire tread, its manufacturing method and the tire using the composition manufacture 韩国轮胎株式会社 2019-10-18 CN claimed
CN-109071754-A The method for being used to prepare urethane acrylate 陶氏环球技术有限责任公司 2018-12-21 CN claimed
CN-108699208-A Curable urethaneacrylates composition with bimodal molecular weight distribution 陶氏环球技术有限责任公司 2018-10-23 CN claimed
CN-108641641-A A kind of preparation method of the polyacrylic hot melt adhesive of maleic anhydride grafting 苏州融达信新材料科技有限公司 2018-10-12 CN claimed
CN-105837947-B A kind of heat-resisting insualtion resin composition 黄河科技学院 2018-06-29 CN claimed
CN-106478129-A Biochemical lignin resin environment-friendly foaming insulation material and preparation method thereof 安徽格义循环经济产业园有限公司 2017-03-08 CN claimed
CN-102597084-B Formulation comprising isosorbide-modified unsaturated polyester resin and low profile additive to produce low profile matrix 亚什兰许可和知识产权有限公司 2016-08-31 CN claimed
EP-2464690-B1 FORMULATIONS COMPRISING ISOSORBIDE-MODIFIED UNSATURATED POLYESTER RESINS AND LOW PROFILE ADDITIVES WHICH PRODUCE LOW SHRINKAGE MATRICES ASHLAND LICENSING & INTELLECTU (US) 2016-05-04 EP claimed
US-9034982-B2 Formulations comprising isosorbide-modified unsaturated polyester resins and low profile additives which produce low shrinkage matrices ASHLAND LICENSING AND INTELLECTUAL PROPERTY, LLC (US) 2015-05-19 US claimed
CN-101885812-B Functionalized poly(arylene ether) composition and method SABIC INNOVATIVE PLASTICS IP 2013-09-11 CN claimed
US-20020177027-A1 Electrically conductive thermoset composition, method for the preparation thereof, and articles derived therefrom SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-11-28 US claimed
US-20020173597-A1 Poly(arylene ether)-containing thermoset composition in powder form, method for the preparation thereof, and articles derived therefrom SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-11-21 US claimed
US-20020169256-A1 Thermoset composition, method, and article SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-11-14 US claimed
WO-2002077102-A1 ABRASIVE-FILLED THERMOSET COMPOSITION AND ITS PREPARATION, AND ABRASIVE-FILLED ARTICLES AND THEIR PREPARATION GENERAL ELECTRIC COMPANY (US) 2002-10-03 WO claimed
WO-2002077103-A1 POLY(ARYLENE ETHER)-CONTAINING THERMOSET COMPOSITION IN POWDER FORM, METHOD FOR THE PREPARATION THEREOF, AND ARTICLES DERIVED THEREFROM GENERAL ELECTRIC COMPANY (US) 2002-10-03 WO claimed
WO-2002057365-A1 ELECTRICALLY CONDUCTIVE THERMOSET COMPOSITION, METHOD FOR THE PREPARATION THEREOF, AND ARTICLES DERIVED THEREFROM GENERAL ELECTRIC COMPANY (US) 2002-07-25 WO claimed
US-20020016420-A1 Curable resin composition, method for the preparation thereof, and articles derived therefrom SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2002-02-07 US claimed
EP-1165690-A1 CURABLE RESIN COMPOSITION, METHOD FOR THE PREPARATION THEREOF, AND ARTICLES DERIVED THEREFROM GENERAL ELECTRIC COMPANY (US) 2002-01-02 EP claimed
US-20010053820-A1 Poly(arylene ether)-containing thermoset composition, method for the preparation thereof, and articles derived therefrom SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2001-12-20 US claimed
WO-2001053413-A1 CURABLE RESIN COMPOSITION, METHOD FOR THE PREPARATION THEREOF, AND ARTICLES DERIVED THEREFROM GENERAL ELECTRIC COMPANY (US) 2001-07-26 WO claimed