SCHEMBL3095394

SCHEMBL3095394

CC(=Cc1cccc(-c2ccccc2)c1)C(=O)O

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 1/20 0.71
TRIM24 O15164 1/20 0.49
TRIM33 Q9UPN9 1/20 0.49
SLC9A1 P19634 1/20 0.47
SLC9A3 P48764 1/20 0.47
SLC9A2 Q9UBY0 1/20 0.47
TP53 P04637 1/20 0.47
TBXAS1 P24557 1/20 0.47
HTT P42858 1/20 0.46
RXRA P19793 1/20 0.45
RXRB P28702 1/20 0.45
NR4A2 P43354 1/20 0.45
RXRG P48443 1/20 0.45
PTGS2 P35354 1/20 0.45
KMO O15229 1/20 0.44
RECQL P46063 1/20 0.43
MEN1 O00255 1/20 0.43
ALDH1A1 P00352 1/20 0.43
KMT2A Q03164 1/20 0.43
APEX1 P27695 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Biphenyl SCHEMBL28220466 0.90 AKR1C3 (0.88) AKR1C3TP53TBXAS1HTTRXRA
SCHEMBL8746678 0.88 AKR1C3 (0.76) AKR1C3SLC9A1SLC9A3SLC9A2TBXAS1
SCHEMBL8746676 0.88 AKR1C3 (0.76) AKR1C3SLC9A1SLC9A3SLC9A2TBXAS1
SCHEMBL532625 0.85 AKR1C3 (0.77) AKR1C3TP53TBXAS1HTTRXRA
SCHEMBL532624 0.85 AKR1C3 (0.77) AKR1C3TP53TBXAS1HTTRXRA
SCHEMBL41906 0.84 AKR1C3 (1.00) AKR1C3TBXAS1HTTRECQLMEN1
SCHEMBL16568719 0.84 AKR1C3 (1.00) AKR1C3TBXAS1HTTRECQLMEN1
SCHEMBL37034 0.84 AKR1C3 (1.00) AKR1C3TBXAS1HTTRECQLMEN1
SCHEMBL581982 0.84 AKR1C3 (1.00) AKR1C3TBXAS1HTTRECQLMEN1
SCHEMBL5439935 0.82 AKR1C3 (0.45) AKR1C3TRIM24TRIM33SLC9A1SLC9A3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116997464-A Glass laminate article and adhesive composition therefor 康宁股份有限公司 2023-11-03 CN disclosed
EP-3517571-A1 (METH)ACRYLIC COPOLYMER, RESIN COMPOSITION, MOLDED BODY OF SAME, AND METHOD FOR PRODUCING MOLDED BODY Mitsubishi Gas Chemical Company, Inc. (JP) 2019-07-31 EP disclosed
US-9606436-B2 Photosensitive resin composition and application thereof CHI MEI CORPORATION (TW) 2017-03-28 US disclosed
US-20170052446-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION THEREOF CHI MEI CORPORATION (TW) 2017-02-23 US disclosed
US-7799844-B2 Active energy beam-curable composition for optical material TOAGOSEI CO., LTD. (JP) 2010-09-21 US disclosed
US-7416821-B2 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) 2008-08-26 US disclosed
US-20070043143-A1 Active energy beam-curable composition for optical material THOMSON LICENSING (FR) 2007-02-22 US disclosed
EP-1743363-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FujiFilm Electronic Materials USA, Inc. (US) 2007-01-17 EP disclosed
US-20050238997-A1 Thermally cured undercoat for lithographic application FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. 2005-10-27 US disclosed
WO-2005089150-A2 THERMALLY CURED UNDERCOAT FOR LITHOGRAPHIC APPLICATION FUJIFILM ELECTRONIC MATERIALS USA INC. (US) 2005-09-29 WO disclosed