SCHEMBL309708

SCHEMBL309708

Nc1cccc(Oc2ccc([S+]([O-])c3ccc(Oc4cccc(N)c4)cc3)cc2)c1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 2/20 0.63
ALDH1A1 P00352 5/20 0.57
MAPT P10636 2/20 0.55
SMN1; SMN2 Q16637 2/20 0.55
MEN1 O00255 2/20 0.55
KMT2A Q03164 2/20 0.55
MITF O75030 1/20 0.55
GAA P10253 1/20 0.55
GFER P55789 1/20 0.55
NLRP1 Q9C000 1/20 0.55
NOD2 Q9HC29 1/20 0.55
ATM Q13315 1/20 0.47
POLB P06746 1/20 0.47
HSP90AA1 P07900 1/20 0.47
CYP3A4 P08684 4/20 0.46
LTA4H P09960 1/20 0.46
NPC1 O15118 1/20 0.44
RAB9A P51151 1/20 0.44
NLRP3 Q96P20 1/20 0.44
MAOA P21397 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8977505 0.88 ALDH1A1 (0.51) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL9246793 0.87 MAOB (0.60) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29363390 0.84 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL1270913 0.84 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29352463 0.84 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL204267 0.84 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL128748 0.84 MAOB (0.86) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL6290749 0.82 MAOB (0.83) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL6289963 0.82 MAOB (0.83) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL6290567 0.82 MAOB (0.83) MAOBALDH1A1MAPTSMN1; SMN2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 451 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7803896-B2 Polyimide-titania hybrid materials, their preparation, and film prepared from the materials NATIONAL TAIWAN UNIVERSITY (TW) 2010-09-28 US claimed
US-20090092759-A1 Polyimide-titania hybrid materials, their preparation, and film prepared from the materials NATIONAL TAIWAN UNIVERSITY (TW) 2009-04-09 US claimed
US-5278276-A Polyamic acid precursor; prepared from bis/aminophenoxyphenyl/ compounds and tetracarboxylic acid dianhydrides MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-01-11 US claimed
CN-117241942-B Laminate body 东洋纺株式会社 2026-05-19 CN disclosed
US-12479194-B2 Laminate TOYOBO CO., LTD. (JP) 2025-11-25 US disclosed
US-12472732-B2 Laminate, method for manufacturing laminate, and method for manufacturing flexible electronic device TOYOBO CO., LTD. (JP) 2025-11-18 US disclosed
US-12391813-B2 Layered body including inorganic substrate and polyamic acid cured product TOYOBO CO., LTD. (JP) 2025-08-19 US disclosed
CN-115551713-B Laminate comprising transparent high heat resistant film 东洋纺株式会社 2025-03-21 CN disclosed
WO-2025047667-A1 SHEET MATERIAL AND METHOD FOR PRODUCING SHEET MATERIAL 東洋紡株式会社 2025-03-06 WO disclosed
US-20250019582-A1 POLYAMIC ACID VARNISH, POLYIMIDE COMPOSITION, AND ADHESIVE MITSUI CHEMICALS, INC. (JP) 2025-01-16 US disclosed
US-20250019508-A1 LAYERED BODY INCLUDING INORGANIC SUBSTRATE AND POLYAMIC ACID CURED PRODUCT TOYOBO CO., LTD. (JP) 2025-01-16 US disclosed
EP-0294144-A1 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-12-07 EP disclosed
US-4788846-A Process for the correction of curls of flexible metal clad laminate and for the improvement of its dimensional stability MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1988-12-06 US disclosed
EP-0288251-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-10-26 EP disclosed
EP-0267289-A1 POLYIMIDE RESIN COMPOSITION MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-05-18 EP disclosed
EP-0264454-A1 METHOD FOR CORRECTING CURL AND IMPROVING DIMENSIONAL STABILITY OF FLEXIBLE METAL FOIL LAMINATED PLATE MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-04-27 EP disclosed
EP-0253586-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-20 EP disclosed
EP-0251741-A2 Polyimide resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1988-01-07 EP disclosed
EP-0235294-A1 POLYIMIDES AND HEAT-RESISTANT ADHESIVES COMPRISING THE SAME MITSUI TOATSU CHEMICALS, Inc. (JP) 1987-09-09 EP disclosed
EP-0192480-A1 Bis(3-aminophenoxy) aromatics and method of preparing the same MITSUI TOATSU CHEMICALS, Inc. (JP) 1986-08-27 EP disclosed