SCHEMBL31017702

SCHEMBL31017702

CCCCCCCCCCC#CC1(C=CCCCCCCCCCC)CC(=O)OC1=O

nearest known ligand 0.38

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.38
TSHR P16473 1/20 0.38
HMGCR P04035 4/20 0.35
PRKCA P17252 12/20 0.33
CDC25B P30305 2/20 0.32
LPAR1 Q92633 1/20 0.32
CDC25A P30304 1/20 0.32
CDC25C P30307 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29738650 0.76 PTPN7 (0.34) ALDH1A1TSHRHMGCRPRKCACDC25B
SCHEMBL30345718 0.76 ALDH1A1 (0.48) ALDH1A1TSHRPRKCACDC25BLPAR1
SCHEMBL3465216 0.76 ALDH1A1 (0.44) ALDH1A1TSHRPRKCACDC25BLPAR1
SCHEMBL28930529 0.76 ALDH1A1 (0.44) ALDH1A1TSHRPRKCACDC25BLPAR1
SCHEMBL1352239 0.76 ALDH1A1 (0.48) ALDH1A1TSHRPRKCACDC25BLPAR1
SCHEMBL28670674 0.72 ALDH1A1 (0.42) ALDH1A1TSHRPRKCACDC25BLPAR1
SCHEMBL724843 0.69 ALDH1A1 (0.45) ALDH1A1TSHRPRKCACDC25BCDC25A
SCHEMBL11146515 0.69 ALDH1A1 (0.39) ALDH1A1TSHRPRKCACDC25BLPAR1
SCHEMBL1353670 0.68 ALDH1A1 (0.41) ALDH1A1TSHRPRKCALPAR1
SCHEMBL28356207 0.68 ALDH1A1 (0.39) ALDH1A1TSHRPRKCACDC25BCDC25A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118891302-A Epoxy resin, cured product of epoxy resin, and method for producing epoxy resin 积水化学工业株式会社 2024-11-01 CN disclosed
CN-118829674-A Epoxy resin, epoxy resin composition, and cured epoxy resin 日铁化学材料株式会社 2024-10-22 CN disclosed
CN-118591574-A Epoxy resin, polyhydroxyl resin, epoxy resin composition, cured epoxy resin, and process for producing polyhydroxyl resin 日铁化学材料株式会社 2024-09-03 CN disclosed
CN-111378093-B Epoxy resin, method for producing same, epoxy resin composition, and epoxy resin cured product 日铁化学材料株式会社 2024-09-03 CN disclosed
CN-111378094-B Epoxy resin, epoxy resin composition, and resin cured product 日铁化学材料株式会社 2024-08-20 CN disclosed