⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9404238 | 0.89 | — | — | |
| SCHEMBL5405139 | 0.85 | — | — | |
| SCHEMBL5425407 | 0.85 | — | — | |
| SCHEMBL331284 | 0.85 | — | — | |
| SCHEMBL5421282 | 0.82 | — | — | |
| SCHEMBL978795 | 0.82 | — | — | |
| SCHEMBL309171 | 0.82 | — | — | |
| SCHEMBL13089385 | 0.80 | — | — | |
| SCHEMBL12898521 | 0.80 | — | — | |
| SCHEMBL13089271 | 0.77 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 537 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122056125-A | RF pulsed assisted low-K film deposition with high mechanical strength | 应用材料公司 | 2026-05-15 | — | — | CN | claimed |
| US-20260117376-A1 | METHOD AND SYSTEM FOR FORMING A SILICON-CONTAINING LAYER AND STRUCTURE FORMED USING SAME | ASM IP HOLDING BV (NL) | 2026-04-30 | — | — | US | claimed |
| US-20250304819-A1 | Flexible and foldable abrasion resistant photopatternable siloxane hard coat | OPTITUNE OY (FI) | 2025-10-02 | — | — | US | claimed |
| WO-2025049147-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-03-06 | — | — | WO | claimed |
| US-20250069884-A1 | METHODS FOR FORMING LOW-K DIELECTRIC MATERIALS WITH REDUCED DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-27 | — | — | US | claimed |
| US-20250054749-A1 | RF PULSING ASSISTED LOW-K FILM DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | US | claimed |
| WO-2025034650-A1 | RF PULSING ASSISTED LOW-K DEPOSITION WITH HIGH MECHANICAL STRENGTH | APPLIED MATERIALS, INC. (US) | 2025-02-13 | — | — | WO | claimed |
| CN-119080473-B | Preparation method of aerogel material for heat insulation oil pipe | 山东美生热能科技有限公司 | 2025-02-11 | — | — | CN | claimed |
| CN-119080473-A | Preparation method of aerogel material for heat insulation oil pipe | 山东美生热能科技有限公司 | 2024-12-06 | — | — | CN | claimed |
| US-12125675-B2 | RF pulsing assisted low-k film deposition with high mechanical strength | APPLIED MATERIALS, INC. (US) | 2024-10-22 | — | — | US | claimed |
| US-20080246153-A1 | ORGANIC SILICA-BASED FILM, METHOD OF FORMING THE SAME, COMPOSITION FOR FORMING INSULATING FILM FOR SEMICONDUCTOR DEVICE, INTERCONNECT STRUCTURE, AND SEMICONDUCTOR DEVICE | JSR CORPORATION (JP) | 2008-10-09 | — | — | US | claimed |
| US-20080199977-A1 | Activated Chemical Process for Enhancing Material Properties of Dielectric Films | AIR PRODUCTS AND CHEMICALS, INC. (US) | 2008-08-21 | — | — | US | claimed |
| EP-1959485-A2 | Activated chemical process for enhancing material properties of dielectric films | Air Products and Chemicals, Inc. (US) | 2008-08-20 | — | — | EP | claimed |
| US-7399715-B2 | Organic silica-based film, method of forming the same, composition for forming insulating film for semiconductor device, interconnect structure, and semiconductor device | JSR CORPORATION (JP) | 2008-07-15 | — | — | US | claimed |
| US-7381659-B2 | Method for reducing film stress for SiCOH low-k dielectric materials | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-06-03 | — | — | US | claimed |
| US-20070181873-A1 | Organic-inorganic hybrid polymer and organic insulator composition having the same and methods thereof | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2007-08-09 | — | — | US | claimed |
| US-20070173071-A1 | SiCOH dielectric | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-07-26 | — | — | US | claimed |
| US-20070117408-A1 | METHOD FOR REDUCING FILM STRESS FOR SICOH LOW-K DIELECTRIC MATERIALS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-05-24 | — | — | US | claimed |
| US-20060165891-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-07-27 | — | — | US | claimed |
| US-20050194619-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-09-08 | — | — | US | claimed |