SCHEMBL3103307

SCHEMBL3103307

CC1C2C=CC(C2)C1(C)OC=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL249317 0.69
SCHEMBL18560024 0.66
SCHEMBL2474088 0.66
SCHEMBL18552681 0.64
SCHEMBL14301947 0.64 TDP1 (0.38)
SCHEMBL11077587 0.63
SCHEMBL11570452 0.62 KMT2A (0.31)
SCHEMBL4896346 0.61 CYP17A1 (0.35)
SCHEMBL13809147 0.60
SCHEMBL7132013 0.59

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2264113-A2 Temporary bonding adhesive for a semiconductor wafer and method for manufacturing a semiconductor device using the same, and use of a resin composition as a temporary bonding adhesive Sumitomo Bakelite Co., Ltd. (JP) 2010-12-22 EP disclosed