SCHEMBL3119958

SCHEMBL3119958

CCN(C)[Si](C)(C)N(C)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17553085 0.83
SCHEMBL24494649 0.81
SCHEMBL24494642 0.78
SCHEMBL6379764 0.77
SCHEMBL641592 0.75
SCHEMBL21828539 0.75
SCHEMBL31405543 0.72
SCHEMBL19250325 0.72
SCHEMBL31722299 0.72
SCHEMBL31722271 0.67

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 125 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12421603-B2 Composition for high temperature atomic layer deposition of high quality silicon oxide thin films VERSUM MATERIALS US, LLC (US) 2025-09-23 US claimed
CN-119900018-A Composition for high temperature atomic layer deposition of high quality silicon oxide films 弗萨姆材料美国有限责任公司 2025-04-29 CN claimed
US-11649547-B2 Deposition of carbon doped silicon oxide VERSUM MATERIALS US, LLC (US) 2023-05-16 US claimed
US-11631580-B2 Formulation for deposition of silicon doped hafnium oxide as ferroelectric materials VERSUM MATERIALS US, LLC (US) 2023-04-18 US claimed
CN-110573651-B Formulations for depositing silicon doped hafnium oxide as ferroelectric material 弗萨姆材料美国有限责任公司 2022-07-22 CN claimed
US-20220189767-A1 FORMULATION FOR DEPOSITION OF SILICON DOPED HAFNIUM OXIDE AS FERROELECTRIC MATERIALS VERSUM MATERIALS US, LLC (US) 2022-06-16 US claimed
US-20210363639-A1 COMPOSITION FOR HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF HIGH QUALITY SILICON OXIDE THIN FILMS VERSUM MATERIALS US, LLC (US) 2021-11-25 US claimed
EP-3902939-A1 DEPOSITION OF CARBON DOPED SILICON OXIDE Versum Materials US, LLC (US) 2021-11-03 EP claimed
CN-113383108-A Deposition of carbon-doped silicon oxide 弗萨姆材料美国有限责任公司 2021-09-10 CN claimed
US-11081337-B2 Formulation for deposition of silicon doped hafnium oxide as ferroelectric materials Versum Materials U.S., LLC (US) 2021-08-03 US claimed
WO-2020072768-A1 COMPOSITION FOR HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF HIGH QUALITY SILICON OXIDE THIN FILMS VERSUM MATERIALS US, LLC (US) 2020-04-09 WO claimed
CN-110573651-A Novel formulations for the deposition of silicon-doped hafnium oxide as ferroelectric material 弗萨姆材料美国有限责任公司 2019-12-13 CN claimed
WO-2018170126-A1 NEW FORMULATION FOR DEPOSITION OF SILICON DOPED HAFNIUM OXIDE AS FERROELECTRIC MATERIALS VERSUM MATERIALS US, LLC (US) 2018-09-20 WO claimed
US-20180269057-A1 Formulation for Deposition of Silicon Doped Hafnium Oxide as Ferroelectric Materials VERSUM MATERIALS US, LLC (US) 2018-09-20 US claimed
EP-2251899-B1 Dielectric barrier deposition using nitrogen containing precursor VERSUM MAT US LLC (US) 2018-03-28 EP claimed
US-9460912-B2 High temperature atomic layer deposition of silicon oxide thin films AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-10-04 US claimed
US-20130295779-A1 HIGH TEMPERATURE ATOMIC LAYER DEPOSITION OF SILICON OXIDE THIN FILMS VERSUM MATERIALS US, LLC 2013-11-07 US claimed
EP-2650399-A2 High temperature atomic layer deposition of silicon oxide thin films AIR PRODUCTS AND CHEMICALS, INC. (US) 2013-10-16 EP claimed
US-20100291321-A1 Dielectric Barrier Deposition Using Nitrogen Containing Precursor AIR PRODUCTS AND CHEMICALS, INC. (US) 2010-11-18 US claimed
EP-2251899-A1 Dielectric barrier deposition using nitrogen containing precursor Air Products and Chemicals, Inc. (US) 2010-11-17 EP claimed