SCHEMBL31205970

SCHEMBL31205970

CCCCC(=O)OC1CCCCC1(c1ccc(O)cc1)c1ccc(O)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 5/20 0.45
KMT2A Q03164 5/20 0.45
MAPT P10636 5/20 0.45
CYP3A4 P08684 3/20 0.45
MEN1 O00255 3/20 0.45
ESR1 P03372 2/20 0.45
PGR P06401 2/20 0.45
ADORA3 P0DMS8 2/20 0.45
AR P10275 2/20 0.45
PTGS1 P23219 2/20 0.45
PDE3A Q14432 2/20 0.45
TP53 P04637 2/20 0.45
SMN1; SMN2 Q16637 2/20 0.45
POLB P06746 1/20 0.45
CHRM1 P11229 1/20 0.45
TBXA2R P21731 1/20 0.45
ATM Q13315 1/20 0.45
USP2 O75604 1/20 0.45
ALOX15 P16050 1/20 0.45
NAAA Q02083 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1501263 0.66 ESR2 (0.48) KMT2AMAPTESR1
SCHEMBL888425 0.66 NAAA (0.42) LMNAKMT2AMAPTCYP3A4MEN1
SCHEMBL28446549 0.66 NAAA (0.62) SMN1; SMN2NAAABCHE
SCHEMBL4978860 0.66 NAAA (0.86) SMN1; SMN2NAAACYP2C19ALDH1A1HTT
SCHEMBL28446547 0.66 NAAA (0.62) SMN1; SMN2NAAABCHE
SCHEMBL9074563 0.66 ESR2 (0.44) KMT2AMEN1ESR1
SCHEMBL30132903 0.65 ESR2 (0.50) MAPTESR1
Hydrochloric Acid SCHEMBL32662564 0.64 NAAA (0.83) SMN1; SMN2NAAACYP2C19ALDH1A1HTT
SCHEMBL8690525 0.64 NAAA (0.86) LMNASMN1; SMN2NAAACYP2C19ALDH1A1
SCHEMBL1177076 0.64 NAAA (0.86) LMNASMN1; SMN2NAAACYP2C19ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024224788-A1 RESIN, COPOLYMER, ELECTRONIC SUBSTRATE MATERIAL, RESIN COMPOSITION, COATING LIQUID COMPOSITION, CURED PRODUCT, FILM, SHEET, AND ELECTRONIC SUBSTRATE 出光興産株式会社 2024-10-31 WO disclosed