SCHEMBL31258167

SCHEMBL31258167

CCCCCCOc1cccc(-c2nc(-c3ccc(C)cc3C)nc(-c3cccc(OCCCCCC)c3O)n2)c1O

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MCHR1 Q99705 2/20 0.40
MAPT P10636 2/20 0.40
MEN1 O00255 1/20 0.40
NR1I2 O75469 1/20 0.40
LMNA P02545 1/20 0.40
CHRM2 P08172 1/20 0.40
CYP3A4 P08684 1/20 0.40
ADRA2A P08913 1/20 0.40
OPRK1 P41145 1/20 0.40
HTR2B P41595 1/20 0.40
SLC6A3 Q01959 1/20 0.40
KMT2A Q03164 1/20 0.40
HDAC6 Q9UBN7 1/20 0.40
PTPN11 Q06124 3/20 0.39
THRA P10827 1/20 0.38
THRB P10828 1/20 0.38
ESR1 P03372 3/20 0.38
PDE5A O76074 1/20 0.38
PDE4A P27815 1/20 0.38
PDE4B Q07343 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4791409 1.00 MCHR1 (0.40) MCHR1MAPTMEN1NR1I2LMNA
SCHEMBL5602712 1.00 MCHR1 (0.40) MCHR1MAPTMEN1NR1I2LMNA
SCHEMBL1424639 1.00 MCHR1 (0.40) MCHR1MAPTMEN1NR1I2LMNA
SCHEMBL9565294 0.92 MAPT (0.43) MCHR1MAPTLMNAKMT2APDE5A
SCHEMBL1906579 0.88 PLA2G4B (0.35) MAPTMEN1LMNAKMT2APTPN11
SCHEMBL30842063 0.88 PLA2G4B (0.35) MAPTMEN1LMNAKMT2APTPN11
SCHEMBL1905764 0.88 PLA2G4B (0.35) MAPTMEN1LMNAKMT2APTPN11
SCHEMBL7249597 0.88 MCHR1 (0.49) MCHR1MAPTMEN1NR1I2LMNA
SCHEMBL4443386 0.87 MAPT (0.33) MAPTMEN1LMNAKMT2ATLR8
SCHEMBL195516 0.87 ESR1 (0.41) MAPTPTPN11THRATHRBESR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114730132-B Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2025-05-09 CN disclosed
CN-119937247-A Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device 富士胶片株式会社 2025-05-06 CN disclosed
CN-114761466-B Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin 富士胶片株式会社 2024-12-10 CN disclosed