SCHEMBL31305484

SCHEMBL31305484

Clc1ccc(-c2c[nH]c(Cc3cccs3)n2)c(Cl)c1

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
POLB P06746 2/20 0.47
ALDH1A1 P00352 2/20 0.47
HPGD P15428 1/20 0.47
HIF1A Q16665 1/20 0.47
CDK4 P11802 1/20 0.41
CCND1 P24385 1/20 0.41
LMNA P02545 2/20 0.39
TSHR P16473 1/20 0.39
ADRA1D P25100 2/20 0.39
MAPT P10636 2/20 0.38
CYP1A2 P05177 1/20 0.38
CYP3A4 P08684 1/20 0.38
CYP2C9 P11712 1/20 0.38
CYP2C19 P33261 1/20 0.38
EGFR P00533 2/20 0.38
ERBB2 P04626 2/20 0.38
NPC1 O15118 2/20 0.37
RAB9A P51151 2/20 0.37
AR P10275 1/20 0.37
PKM P14618 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14060497 1.00 POLB (0.47) POLBALDH1A1HPGDHIF1ACDK4
SCHEMBL14059788 0.90 POLB (0.42) POLBALDH1A1HPGDHIF1ACDK4
SCHEMBL31305534 0.90 POLB (0.42) POLBALDH1A1HPGDHIF1ACDK4
SCHEMBL14059765 0.86 TSHR (0.45) POLBALDH1A1CDK4CCND1LMNA
SCHEMBL31305512 0.86 TSHR (0.45) POLBALDH1A1CDK4CCND1LMNA
SCHEMBL14059775 0.82 POLB (0.42) POLBCDK4CCND1LMNATSHR
SCHEMBL14060372 0.82 POLB (0.50) POLBALDH1A1HIF1ACDK4CCND1
SCHEMBL14060042 0.81 LMNA (0.40) POLBALDH1A1CDK4CCND1LMNA
SCHEMBL31305495 0.81 LMNA (0.40) POLBALDH1A1CDK4CCND1LMNA
SCHEMBL14060621 0.81 LMNA (0.42) POLBALDH1A1HIF1ACDK4CCND1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed