SCHEMBL3131069

SCHEMBL3131069

CC=Cc1cccc(OCC2CO2)c1OCC1CO1

nearest known ligand 0.53

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 5/20 0.53
GLA P06280 1/20 0.53
TP53 P04637 3/20 0.44
TSHR P16473 3/20 0.44
HIF1A Q16665 2/20 0.44
CYP3A4 P08684 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
TDP1 Q9NUW8 1/20 0.41
MEN1 O00255 3/20 0.37
KMT2A Q03164 3/20 0.37
MAPT P10636 2/20 0.37
HPGD P15428 2/20 0.37
CYP1A2 P05177 1/20 0.37
PPARG P37231 1/20 0.37
SLC6A2 P23975 2/20 0.35
HTR2A P28223 2/20 0.35
SLC6A4 P31645 2/20 0.35
HTR2B P41595 2/20 0.35
SLC6A3 Q01959 2/20 0.35
ADRB2 P07550 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9629812 0.92 ALDH1A1 (0.50) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL11436969 0.91 ALDH1A1 (0.49) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL11436971 0.91 ALDH1A1 (0.49) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL3122426 0.87 ALDH1A1 (0.46) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL8156166 0.87 ALDH1A1 (0.61) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL8156163 0.87 ALDH1A1 (0.61) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL29712017 0.82 ALDH1A1 (0.51) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL3131074 0.82 ALDH1A1 (0.51) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL3133307 0.82 ALDH1A1 (0.58) ALDH1A1GLATP53TSHRHIF1A
SCHEMBL680532 0.81 ALDH1A1 (0.65) ALDH1A1GLATP53TSHRHIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 56 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240045329-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND TORAY INDUSTRIES, INC. (JP) 2024-02-08 US disclosed
WO-2023048016-A1 RESIN COMPOSITION, LIGHT-SHIELDING FILM, AND SUBSTRATE WITH PARTITIONING WALL 東レ株式会社 2023-03-30 WO disclosed
WO-2023038092-A1 PHOTOSENSITIVE COMPOSITION, CURED FILM OBTAINED THEREFROM, COLOR FILTER, OPTICAL FILTER, IMAGE DISPLAY DEVICE, SOLID IMAGING ELEMENT, AND INFRARED SENSOR 東洋インキSCホールディングス株式会社 2023-03-16 WO disclosed
US-11422464-B2 Photosensitive resin composition, method of producing electrically conductive pattern, substrate, touch panel, and display TORAY INDUSTRIES, INC. (JP) 2022-08-23 US disclosed
WO-2022163335-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, ELECTRONIC COMPONENT, ANTENNA ELEMENT, SEMICONDUCTOR PACKAGE, AND COMPOUND 東レ株式会社 2022-08-04 WO disclosed
CN-109791352-B Photosensitive resin composition, method for producing conductive pattern, substrate, touch panel, and display 东丽株式会社 2022-07-29 CN disclosed
CN-108369376-B Photosensitive resin composition, cured film, laminate, member for touch panel, and method for producing cured film 东丽株式会社 2022-05-03 CN disclosed
WO-2021132631-A1 THERMALLY CURABLE HARDCOAT AGENT, LAYERED FILM, AND DECORATED MOLDED OBJECT 東洋インキSCホールディングス株式会社 2021-07-01 WO disclosed
US-20210198416-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, MEMBER FOR TOUCH PANEL, AND METHOD FOR MANUFACTURING CURED FILM TORAY INDUSTRIES, INC. (JP) 2021-07-01 US disclosed
CN-109071953-B Resin composition, cured film, method for producing cured film, and display device 东丽株式会社 2021-05-25 CN disclosed
US-6797450-B2 ALKALI-SOLUBLE RESIN HAVING NO EPOXY GROUP AND A 1,2-QUINONEDIAZIDE COMPOUND JSR CORPORATION (JP) 2004-09-28 US disclosed
EP-1312982-A1 RADIATION-SENSITIVE COMPOSITION, INSULATING FILM AND ORGANIC EL DISPLAY ELEMENT JSR Corporation (JP) 2003-05-21 EP disclosed
US-20030068574-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR CORPORATION (JP) 2003-04-10 US disclosed
EP-1296186-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
EP-0880075-B1 Radiation sensitive resin composition JSR CORP (JP) 2001-10-17 EP disclosed
US-6168908-B1 COATING AN ALKALI-SOLUBLE THERMOSETTING RESIN ON A SUBSTRATE, AND BAKING IT, COATING A RADIATION SENSITIVE RESIN ON THE COATED FILM, AND BAKING, EXPOSING THE RADIATION SENSITIVE FILM TO A RADIATION THROUGH A MASK AND BAKING, DEVELOPING JSR CORPORATION (JP) 2001-01-02 US disclosed
US-5958648-A Radiation sensitive resin composition JSR CORPORATION (JP) 1999-09-28 US disclosed
EP-0908780-A1 Process for forming a cured film of a thermosetting resin JSR Corporation (JP) 1999-04-14 EP disclosed
EP-0880075-A1 Radiation sensitive resin composition JSR Corporation (JP) 1998-11-25 EP disclosed