SCHEMBL3131801

SCHEMBL3131801

Cc1[nH]c(-c2ccccc2)nc1-c1cc(Cl)ccc1Cl

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPY5R Q15761 5/20 0.51
HPGDS O60760 1/20 0.50
KDM4E B2RXH2 1/20 0.49
MEN1 O00255 1/20 0.49
ALDH1A1 P00352 1/20 0.49
TP53 P04637 1/20 0.49
CYP3A4 P08684 1/20 0.49
MAPT P10636 1/20 0.49
HPGD P15428 1/20 0.49
MAPK1 P28482 1/20 0.49
KMT2A Q03164 1/20 0.49
HSD17B10 Q99714 1/20 0.49
FTO Q9C0B1 1/20 0.49
MAPK13 O15264 7/20 0.46
MAPK12 P53778 7/20 0.46
MAPK11 Q15759 7/20 0.46
MAPK14 Q16539 7/20 0.46
RAF1 P04049 6/20 0.46
PIN1 Q13526 2/20 0.46
SMPD3 Q9NY59 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31305517 1.00 NPY5R (0.51) NPY5RHPGDSKDM4EMEN1ALDH1A1
SCHEMBL31305479 0.89 NPY5R (0.52) NPY5RHPGDSKDM4EMEN1ALDH1A1
SCHEMBL29889974 0.89 NPY5R (0.50) NPY5RHPGDSKDM4EMEN1ALDH1A1
SCHEMBL3138047 0.89 NPY5R (0.52) NPY5RHPGDSKDM4EMEN1ALDH1A1
SCHEMBL2943488 0.89 NPY5R (0.50) NPY5RHPGDSKDM4EMEN1ALDH1A1
SCHEMBL28406436 0.87 MAPK13 (0.50) NPY5RMAPK13MAPK12MAPK11MAPK14
SCHEMBL28398023 0.85 NPY5R (0.71) NPY5RKDM4EALDH1A1MAPTHPGD
SCHEMBL26110700 0.85 MAPK13 (0.57) NPY5RHPGDSTP53CYP3A4HPGD
SCHEMBL28406413 0.82 NPY5R (0.41) NPY5RHPGDSKDM4EMEN1ALDH1A1
SCHEMBL14059818 0.81 NPY5R (0.41) NPY5RALDH1A1TP53PIN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed