SCHEMBL3138047

SCHEMBL3138047

Cc1[nH]c(-c2cc(Cl)ccc2Cl)nc1-c1ccccc1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPY5R Q15761 5/20 0.52
SMPD3 Q9NY59 1/20 0.48
HPGDS O60760 1/20 0.47
SLC9A1 P19634 1/20 0.46
ALDH1A1 P00352 2/20 0.43
RXFP1 Q9HBX9 1/20 0.43
CXCR2 P25025 1/20 0.43
MAPK13 O15264 2/20 0.43
RAF1 P04049 2/20 0.43
MAPK12 P53778 2/20 0.43
MAPK11 Q15759 2/20 0.43
MAPK14 Q16539 2/20 0.43
PIN1 Q13526 1/20 0.43
KDM4E B2RXH2 2/20 0.42
MEN1 O00255 2/20 0.42
KMT2A Q03164 2/20 0.42
HSD17B10 Q99714 2/20 0.42
TP53 P04637 1/20 0.42
CYP3A4 P08684 1/20 0.42
MAPT P10636 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31305479 1.00 NPY5R (0.52) NPY5RSMPD3HPGDSSLC9A1ALDH1A1
SCHEMBL3131801 0.89 NPY5R (0.51) NPY5RSMPD3HPGDSALDH1A1MAPK13
SCHEMBL31305517 0.89 NPY5R (0.51) NPY5RSMPD3HPGDSALDH1A1MAPK13
SCHEMBL31305519 0.89 NPY5R (0.52) NPY5RSMPD3HPGDSALDH1A1CXCR2
SCHEMBL2951516 0.89 NPY5R (0.52) NPY5RSMPD3HPGDSALDH1A1CXCR2
SCHEMBL27762185 0.85 MAPK14 (0.54) NPY5RSMPD3HPGDSSLC9A1ALDH1A1
SCHEMBL27762179 0.81 NPY5R (0.68) NPY5RSMPD3HPGDSSLC9A1ALDH1A1
SCHEMBL3133115 0.80 NPY5R (0.71) NPY5RSMPD3HPGDSMAPK13RAF1
SCHEMBL3141271 0.80 NPY5R (0.71) NPY5RSMPD3HPGDSMAPK13RAF1
SCHEMBL29889974 0.80 NPY5R (0.50) NPY5RSMPD3HPGDSALDH1A1MAPK13

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed