SCHEMBL313276

SCHEMBL313276

C[SiH](C)[SiH3]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8381557 0.83
SCHEMBL1132847 0.72
SCHEMBL316487 0.72
SCHEMBL3263048 0.72
SCHEMBL2992262 0.72
SCHEMBL8385899 0.72
SCHEMBL8335354 0.72
SCHEMBL1025425 0.67
SCHEMBL8383796 0.65
SCHEMBL8382612 0.65

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2129 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260090068-A1 SEMICONDUCTOR DEVICE AND METHODS OF FORMATION TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2026-03-26 US claimed
US-20250372373-A1 GATE-ALL-AROUND (GAA) INTERFACE MODIFICATIONS TO IMPROVE ABRUPTNESS APPLIED MATERIALS INC (US) 2025-12-04 US claimed
US-20250338599-A1 SEMICONDUCTOR GATE STRUCTURE AND METHODS OF FORMING THE SAME TAIWAN SEMICONDUCTOR MFG CO LTD (TW) 2025-10-30 US claimed
CN-119823437-A Preparation method of antistatic high-elasticity TPU 浙江驭能新材料科技有限公司 2025-04-15 CN claimed
CN-117925165-A High-temperature-resistant high-humidity epoxy magnetic circuit adhesive and preparation method thereof 广东德聚技术股份有限公司 2024-04-26 CN claimed
CN-116143546-B High-strength low-impurity foam carbon material and preparation method thereof 陕西美兰德新材料股份有限公司 2024-02-06 CN claimed
CN-114797993-B Surface hydroxyl shielding and surface modifying method for solid catalyst 太原工业学院 2023-10-27 CN claimed
CN-114768823-B Method for preparing oil product by hydrogenating synthesis gas 太原工业学院 2023-10-27 CN claimed
EP-3663301-B1 BORON-CONTAINING COMPOUNDS, COMPOSITIONS, AND METHODS FOR THE DEPOSITION OF BORON CONTAINING FILMS VERSUM MAT US LLC (US) 2023-08-30 EP claimed
CN-116581282-A Alloyed negative electrode material, preparation method and application thereof 北京壹金新能源科技有限公司 2023-08-11 CN claimed
CN-101444457-B Lotion light type eyeshadow cream HONGLIANG DU 2010-12-08 CN claimed
US-7629267-B2 High stress nitride film and method for formation thereof ASM INTERNATIONAL N.V. (NL) 2009-12-08 US claimed
CN-101444457-A Lotion light type eyeshadow cream HONGLIANG DU (CN) 2009-06-03 CN claimed
CN-1311097-C Mechanical enhancer additives for low dielectric films AIR PROD & CHEM (US) 2007-04-18 CN claimed
US-20060199357-A1 High stress nitride film and method for formation thereof ASM INTERNATIONAL N.V. (NL) 2006-09-07 US claimed
EP-1178844-B1 ABSORBENT ARTICLE HAVING A SKIN CARE COMPOSITION PROCTER & GAMBLE (US) 2005-10-26 EP claimed
CN-1576390-A Mechanical enhancer additives for low dielectric films AIR PROD & CHEM (US) 2005-02-09 CN claimed
US-20040241463-A1 Mechanical enhancer additives for low dielectric films VERSUM MATERIALS US, LLC 2004-12-02 US claimed
EP-1482070-A1 Mechanical enhancer additives for low dielectric films AIR PRODUCTS AND CHEMICALS, INC. (US) 2004-12-01 EP claimed
US-4206252-A CONTINUOUS PROCESSING, VAPOR DEPOSITION GORDON ROY G 1980-06-03 US claimed