SCHEMBL3133102

SCHEMBL3133102

Cc1[nH]c(-c2ccccc2)nc1-c1c(Cl)cccc1Cl

nearest known ligand 0.55

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
NPY5R Q15761 3/20 0.55
HPGDS O60760 1/20 0.55
PIN1 Q13526 2/20 0.47
POLB P06746 1/20 0.47
MAPK13 O15264 5/20 0.47
RAF1 P04049 5/20 0.47
MAPK12 P53778 5/20 0.47
MAPK11 Q15759 5/20 0.47
MAPK14 Q16539 5/20 0.47
SMPD3 Q9NY59 1/20 0.46
MAPT P10636 2/20 0.42
GAA P10253 1/20 0.41
GUSB P08236 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28399043 0.88 MAPK13 (0.51) NPY5RMAPK13RAF1MAPK12MAPK11
SCHEMBL3141192 0.87 NPY5R (0.51) NPY5RHPGDSPIN1POLBMAPK13
SCHEMBL26110700 0.84 MAPK13 (0.57) NPY5RHPGDSPIN1POLBMAPK13
SCHEMBL28400620 0.84 NPY5R (0.70) NPY5RHPGDSMAPT
SCHEMBL31305526 0.83 NPY5R (0.51) NPY5RHPGDSPIN1POLBMAPK13
SCHEMBL3137367 0.83 NPY5R (0.51) NPY5RHPGDSPIN1POLBMAPK13
SCHEMBL28402897 0.82 IDO1 (0.44) NPY5RHPGDSPIN1MAPK13RAF1
SCHEMBL14060830 0.81 NPY5R (0.40) NPY5RHPGDSPIN1MAPK13RAF1
SCHEMBL724250 0.81 NPY5R (0.72) NPY5RHPGDSPIN1POLBMAPK13
SCHEMBL3130858 0.81 MAPK13 (0.61) NPY5RHPGDSPIN1POLBMAPK13

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed