SCHEMBL3137367

SCHEMBL3137367

Cc1[nH]c(-c2ccccc2)nc1-c1cccc(Cl)c1Cl

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NPY5R Q15761 4/20 0.51
HPGDS O60760 1/20 0.51
MAPK14 Q16539 2/20 0.50
MAPK13 O15264 1/20 0.50
RAF1 P04049 1/20 0.50
MAPK12 P53778 1/20 0.50
MAPK11 Q15759 1/20 0.50
PIN1 Q13526 2/20 0.44
POLB P06746 1/20 0.44
SMPD3 Q9NY59 1/20 0.43
PTGS1 P23219 1/20 0.41
PTGS2 P35354 1/20 0.41
SLC9A1 P19634 1/20 0.41
MGAM O43451 1/20 0.40
GAA P10253 1/20 0.40
SI P14410 1/20 0.40
MGAM2 Q2M2H8 1/20 0.40
TNKS O95271 1/20 0.40
PARP1 P09874 1/20 0.40
TNKS2 Q9H2K2 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31305526 1.00 NPY5R (0.51) NPY5RHPGDSMAPK14MAPK13RAF1
SCHEMBL26110700 0.89 MAPK13 (0.57) NPY5RHPGDSMAPK14MAPK13RAF1
SCHEMBL28400613 0.89 MAPK14 (0.54) NPY5RMAPK14MAPK13RAF1MAPK12
SCHEMBL31305568 0.88 NPY5R (0.48) NPY5RHPGDSMAPK14MAPK13RAF1
SCHEMBL3128349 0.88 NPY5R (0.48) NPY5RHPGDSMAPK14MAPK13RAF1
SCHEMBL28889078 0.85 NPY5R (0.65) NPY5RMAPK14MAPK13RAF1MAPK12
SCHEMBL28406358 0.83 IDO1 (0.47) NPY5RHPGDSMAPK14MAPK13RAF1
SCHEMBL3133102 0.83 NPY5R (0.55) NPY5RHPGDSMAPK14MAPK13RAF1
SCHEMBL14060349 0.82 ENPP1 (0.40) NPY5RHPGDSMAPK14MAPK13RAF1
SCHEMBL31305547 0.82 ENPP1 (0.40) NPY5RHPGDSMAPK14MAPK13RAF1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
CN-1761773-B Novel imidazole compound and usage thereof SHIKOKU CHEM 2010-05-05 CN disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
CN-1761773-A Novel imidazole compound and usage thereof SHIKOKU CHEM (JP) 2006-04-19 CN disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed