SCHEMBL31339057

SCHEMBL31339057

c1ccc2c3oc(c2c1)C3

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 4/20 0.38
▸ HSD17B10 Q99714 4/20 0.38
▸ MAOA P21397 2/20 0.38
▸ MAPT P10636 2/20 0.38
▸ SMN1; SMN2 Q16637 2/20 0.38
▸ KDM4E B2RXH2 1/20 0.38
▸ GLA P06280 1/20 0.38
▸ CYP3A4 P08684 1/20 0.38
▸ HPGD P15428 1/20 0.38
▸ PGAM1 P18669 1/20 0.38
▸ CASP1 P29466 1/20 0.38
▸ CASP7 P55210 1/20 0.38
▸ CYP2A6 P11509 2/20 0.35
▸ TSHR P16473 1/20 0.35
▸ TDP1 Q9NUW8 1/20 0.35
▸ CYP1A2 P05177 3/20 0.33
▸ IDO1 P14902 1/20 0.33
▸ MAOB P27338 1/20 0.33
▸ GMNN O75496 1/20 0.32
▸ LMNA P02545 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL34466983 0.84 ALDH1A1 (0.36) ALDH1A1HSD17B10MAOAMAPTSMN1; SMN2
SCHEMBL8435652 0.68 KDM4E (0.44) ALDH1A1HSD17B10MAOAMAPTSMN1; SMN2
SCHEMBL8161238 0.67 IDO1 (0.47) ALDH1A1HSD17B10MAOAMAPTSMN1; SMN2
SCHEMBL31304939 0.65 ALDH1A1 (0.41) ALDH1A1HSD17B10MAOAMAPTSMN1; SMN2
SCHEMBL31467394 0.64 HPRT1 (0.57) ALDH1A1HSD17B10SMN1; SMN2KDM4EHPGD
Triphenylene SCHEMBL311118 0.64 HPRT1 (0.57) ALDH1A1HSD17B10SMN1; SMN2KDM4EHPGD
Triphenylene SCHEMBL25597 0.64 HPRT1 (0.57) ALDH1A1HSD17B10SMN1; SMN2KDM4EHPGD
SCHEMBL30977781 0.64 HPRT1 (0.57) ALDH1A1HSD17B10SMN1; SMN2KDM4EHPGD
SCHEMBL1006251 0.64 HPRT1 (0.57) ALDH1A1HSD17B10SMN1; SMN2KDM4EHPGD
Triphenylene SCHEMBL29698924 0.64 HPRT1 (0.57) ALDH1A1HSD17B10SMN1; SMN2KDM4EHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118974883-A Method for manufacturing semiconductor device, material for forming hybrid bond insulating film, and semiconductor device 艾曲迪微系统股份有限公司 2024-11-15 — — CN disclosed
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