SCHEMBL3136969

SCHEMBL3136969

Clc1cc(Cl)cc(-c2c[nH]c(-c3ccccc3)n2)c1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPK13 O15264 3/20 0.49
RAF1 P04049 3/20 0.49
MAPK12 P53778 3/20 0.49
MAPK11 Q15759 3/20 0.49
MAPK14 Q16539 3/20 0.49
ADORA1 P30542 3/20 0.44
ADORA2A P29274 2/20 0.44
ADORA2B P29275 1/20 0.44
CXCR2 P25025 2/20 0.42
MEN1 O00255 2/20 0.41
ALDH1A1 P00352 2/20 0.41
HPGD P15428 2/20 0.41
KMT2A Q03164 2/20 0.41
KDM4E B2RXH2 2/20 0.41
TP53 P04637 1/20 0.41
CYP3A4 P08684 1/20 0.41
MAPT P10636 1/20 0.41
MAPK1 P28482 1/20 0.41
HSD17B10 Q99714 1/20 0.41
FTO Q9C0B1 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3134062 0.93 CXCR2 (0.46) MAPK13RAF1MAPK12MAPK11MAPK14
SCHEMBL26112355 0.90 SCN2A (0.51) MAPK13RAF1MAPK12MAPK11MAPK14
SCHEMBL26113142 0.85 CXCR2 (0.49) MAPK13RAF1MAPK12MAPK11MAPK14
SCHEMBL31305506 0.85 CXCR2 (0.49) MAPK13RAF1MAPK12MAPK11MAPK14
SCHEMBL28398758 0.85 MAPK13 (0.51) MAPK13RAF1MAPK12MAPK11MAPK14
SCHEMBL3140919 0.84 NR1H2 (0.51) MAPK13RAF1MAPK12MAPK11MAPK14
SCHEMBL3136907 0.84 NR1H2 (0.51) MAPK13RAF1MAPK12MAPK11MAPK14
SCHEMBL17279780 0.83 MEN1 (0.43) ADORA1ADORA2AMEN1ALDH1A1HPGD
SCHEMBL528246 0.83 MEN1 (0.46) ADORA1ADORA2AMEN1ALDH1A1HPGD
SCHEMBL28402640 0.83 NPY5R (0.51) MAPK13RAF1MAPK12MAPK11MAPK14

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed