SCHEMBL3134062

SCHEMBL3134062

Clc1cc(Cl)cc(-c2nc(-c3ccccc3)c[nH]2)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CXCR2 P25025 2/20 0.46
ALDH1A1 P00352 4/20 0.44
MEN1 O00255 3/20 0.44
HPGD P15428 3/20 0.44
KMT2A Q03164 3/20 0.44
L3MBTL1 Q9Y468 2/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
MAPK13 O15264 1/20 0.42
RAF1 P04049 1/20 0.42
MAPK12 P53778 1/20 0.42
MAPK11 Q15759 1/20 0.42
MAPK14 Q16539 1/20 0.42
ADORA2A P29274 2/20 0.41
ADORA1 P30542 2/20 0.41
ADORA2B P29275 1/20 0.41
GFER P55789 1/20 0.40
RXFP1 Q9HBX9 1/20 0.40
KDM4E B2RXH2 3/20 0.39
HSP90AA1 P07900 1/20 0.39
HSP90AB1 P08238 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3136969 0.93 MAPK13 (0.49) CXCR2ALDH1A1MEN1HPGDKMT2A
SCHEMBL26113142 0.88 CXCR2 (0.49) CXCR2ALDH1A1MEN1HPGDKMT2A
SCHEMBL31305506 0.88 CXCR2 (0.49) CXCR2ALDH1A1MEN1HPGDKMT2A
SCHEMBL26112355 0.86 SCN2A (0.51) CXCR2ALDH1A1MEN1HPGDKMT2A
SCHEMBL3136907 0.84 NR1H2 (0.51) CXCR2ALDH1A1MEN1HPGDKMT2A
SCHEMBL3140919 0.84 NR1H2 (0.51) CXCR2ALDH1A1MEN1HPGDKMT2A
SCHEMBL528246 0.83 MEN1 (0.46) ALDH1A1MEN1HPGDKMT2AL3MBTL1
SCHEMBL17279786 0.82 MEN1 (0.46) ALDH1A1MEN1HPGDKMT2AL3MBTL1
SCHEMBL3130583 0.80 CXCR2 (0.48) CXCR2ALDH1A1MEN1HPGDKMT2A
SCHEMBL28402640 0.80 NPY5R (0.51) ALDH1A1HPGDKMT2ASMN1; SMN2MAPK13

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250215572-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY SHIKOKU CHEMICALS CORPORATION (JP) 2025-07-03 US disclosed
EP-4506488-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY Shikoku Chemicals Corporation (JP) 2025-02-12 EP disclosed
CN-118922584-A Surface treating agent for copper or copper alloy 四国化成工业株式会社 2024-11-08 CN disclosed
WO-2023190263-A1 SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY 四国化成工業株式会社 2023-10-05 WO disclosed
EP-1605078-B1 SOLDERING PROCESS USING IMIDAZOLE COMPOUND SHIKOKU CHEM (JP) 2010-07-21 EP disclosed
US-7661577-B2 Treating copper or copper alloy surface for lead-free soldering by treating with imidazole compound such as 2-(2,3-dichlorophenyl)-4-phenyl-5-methylimidazole SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-16 US disclosed
US-20070113930-A1 Novel imidazole compound and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2007-05-24 US disclosed
EP-1605078-A1 NOVEL IMIDAZOLE COMPOUND AND USAGE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2005-12-14 EP disclosed