⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2126835 | 0.93 | — | — | |
| SCHEMBL15576727 | 0.83 | — | — | |
| SCHEMBL13237682 | 0.72 | — | — | |
| SCHEMBL12727148 | 0.72 | — | — | |
| SCHEMBL1690897 | 0.72 | — | — | |
| SCHEMBL15038434 | 0.72 | — | — | |
| SCHEMBL15218470 | 0.72 | — | — | |
| SCHEMBL19274744 | 0.72 | — | — | |
| SCHEMBL13109713 | 0.72 | — | — | |
| SCHEMBL17012280 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 490 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119954656-A | Method for preparing aniline compound from lignin and model compound thereof | 中国矿业大学 | 2025-05-09 | — | — | CN | claimed |
| CN-115613087-A | High-hardness nano Ni-Co-B alloy chromium-substituting electroplating solution and application thereof | 哈尔滨工业大学 | 2023-01-17 | — | — | CN | claimed |
| CN-115536842-A | Preparation method of micron tube | 浙江师范大学 | 2022-12-30 | — | — | CN | claimed |
| CN-112482024-B | Preparation method of copper-plated carbon fabric electromagnetic shielding material | 南京信息工程大学 | 2022-09-23 | — | — | CN | claimed |
| US-11328834-B2 | Nanowires-based transparent conductors | CAMBRIOS FILM SOLUTIONS CORPORATION (VG) | 2022-05-10 | — | — | US | claimed |
| CN-114340187-A | Method for preparing flexible printed circuit by using copper-nickel composite nano particles | 清华大学 | 2022-04-12 | — | — | CN | claimed |
| CN-113718237-A | Hydrophobic coating and air conditioner water pan comprising same | 海信（山东）空调有限公司 | 2021-11-30 | — | — | CN | claimed |
| CN-110102773-B | Preparation method of ordered mesoporous Ni nanoparticles with controllable particle size | 北京化工大学 | 2020-09-22 | — | — | CN | claimed |
| US-20200161017-A1 | NANOWIRES-BASED TRANSPARENT CONDUCTORS | PINE CASTLE INVESTMENTS LIMITED (VG) | 2020-05-21 | — | — | US | claimed |
| CN-110724943-A | Palladium-free activating solution before chemical nickel plating on copper surface, preparation method and nickel plating method | 四川英创力电子科技股份有限公司 | 2020-01-24 | — | — | CN | claimed |
| EP-2059107-A1 | METHOD FOR MANUFACTURING LIGHT TRANSMITTING ELECTROMAGNETIC WAVE SHIELDING MATERIAL, LIGHT TRANSMITTING ELECTROMAGNETIC WAVE SHIELDING MATERIAL AND FILTER FOR DISPLAY | BRIDGESTONE CORPORATION (JP) | 2009-05-13 | — | — | EP | claimed |
| US-20080146022-A1 | Methods of Forming Conductive Interconnects | MICRON TECHNOLOGY, INC. | 2008-06-19 | — | — | US | claimed |
| EP-1920472-A1 | METHOD FOR APPLYING A METALLIC COVERING LAYER TO A HIGH-TEMPERATURE SUPERCONDUCTOR | Trithor GMBH (DE) | 2008-05-14 | — | — | EP | claimed |
| US-7358170-B2 | Methods of forming conductive interconnects, and methods of depositing nickel | MICRON TECHNOLOGY, INC. (US) | 2008-04-15 | — | — | US | claimed |
| WO-2008000485-A1 | METHOD FOR APPLYING A METALLIC COVERING LAYER TO A HIGH-TEMPERATURE SUPERCONDUCTOR | ZENERGY POWER GMBH (DE) | 2008-01-03 | — | — | WO | claimed |
| US-20050287305-A1 | Methods of forming conductive interconnects, and methods of depositing nickel | MICRON TECHNOLOGY, INC. | 2005-12-29 | — | — | US | claimed |
| US-20030018179-A1 | Method for generating nucleation centers for selective heterogeneous growth of metal clusters on DNA molecules | TECHNISCHE UNIVERSITAT DRESDEN (DE) | 2003-01-23 | — | — | US | claimed |
| US-6335104-B1 | Method for preparing a conductive pad for electrical connection and conductive pad formed | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2002-01-01 | — | — | US | claimed |
| US-4761304-A | ELECTROLESS DEPOSITION OF METALS, LAMINATION, IMAGES | LEARONAL, INC. (US) | 1988-08-02 | — | — | US | claimed |
| US-4563371-A | Process for preparing metallized porous solid bodies | BAYER AKTIENGESELLSCHAFT (DE) | 1986-01-07 | — | — | US | claimed |