SCHEMBL2126835

SCHEMBL2126835

CB(C)N.[Ni]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL313893 0.93
SCHEMBL15576727 0.77
SCHEMBL12727148 0.67
SCHEMBL19274744 0.67
SCHEMBL13237682 0.67
SCHEMBL13109713 0.67
SCHEMBL15038434 0.67
SCHEMBL1690897 0.67
SCHEMBL15218470 0.67
SCHEMBL22985774 0.60

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2051820-B1 PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES MACDERMID INC (US) 2012-04-25 EP disclosed
US-7704562-B2 Process for improving the adhesion of polymeric materials to metal surfaces CITIBANK, N.A. 2010-04-27 US disclosed
EP-2051820-A2 PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES MacDermid, Incorporated (US) 2009-04-29 EP disclosed
WO-2008020910-A2 PROCESS FOR IMPROVING THE ADHESION OF POLYMERIC MATERIALS TO METAL SURFACES MACDERMID, INCORPORATED (US) 2008-02-21 WO disclosed
US-20080038476-A1 Process for improving the adhesion of polymeric materials to metal surfaces CITIBANK, N.A. 2008-02-14 US disclosed