SCHEMBL31429616

SCHEMBL31429616

CCOc1cccc(-c2nc(CC)c[nH]2)c1O

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PLG P00747 5/20 0.48
PLAU P00749 5/20 0.48
F10 P00742 4/20 0.48
F2 P00734 3/20 0.48
PLAT P00750 3/20 0.48
GAA P10253 2/20 0.40
PDE5A O76074 4/20 0.39
GUSB P08236 2/20 0.38
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
NPC1 O15118 1/20 0.38
CASP3 P42574 1/20 0.38
RAB9A P51151 1/20 0.38
SENP7 Q9BQF6 1/20 0.38
SENP6 Q9GZR1 1/20 0.38
PDE1A P54750 1/20 0.36
PDE1B Q01064 1/20 0.36
PDE1C Q14123 1/20 0.36
IGF1R P08069 1/20 0.36
POLB P06746 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429680 0.87 GUSB (0.48) PLGPLAUF10F2PLAT
SCHEMBL31429642 0.86 PLG (0.48) PLGPLAUF10F2PLAT
SCHEMBL31429618 0.82 PLG (0.45) PLGPLAUF10F2PLAT
SCHEMBL31429624 0.81 MGAM (0.46) GAAPDE5AGUSB
SCHEMBL31429599 0.80 MGAM (0.41) PLGPLAUF10F2PLAT
SCHEMBL31429630 0.77 PLG (0.50) PLGPLAUF10F2PLAT
SCHEMBL31429718 0.76 CA2 (0.44) GAA
SCHEMBL31429702 0.75 PLG (0.54) PLGPLAUF10F2PLAT
SCHEMBL31429625 0.74 DCUN1D1 (0.45) GAAPDE5AGUSBMEN1KMT2A
SCHEMBL7233070 0.73 PLG (0.48) PLGPLAUF10F2PLAT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L PLG 3950/4885PLAU 4632/4885F10 2016/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.