SCHEMBL31429619

SCHEMBL31429619

CCc1c[nH]c(-c2ccc(Cl)cc2O)n1

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 7/20 0.40
HSP90AA1 P07900 3/20 0.38
LMNA P02545 3/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
KDM4E B2RXH2 2/20 0.37
NPC1 O15118 2/20 0.37
CASP3 P42574 2/20 0.37
CDK9 P50750 2/20 0.37
RAB9A P51151 2/20 0.37
SENP7 Q9BQF6 2/20 0.37
NFKB1 P19838 1/20 0.37
CDK5 Q00535 1/20 0.37
NFKB2 Q00653 1/20 0.37
RELA Q04206 1/20 0.37
CDK5R1 Q15078 1/20 0.37
SENP8 Q96LD8 1/20 0.37
SENP6 Q9GZR1 1/20 0.37
PIM1 P11309 1/20 0.37
ALDH1A1 P00352 3/20 0.36
CYP3A4 P08684 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31429726 0.92 IDO1 (0.48) IDO1HSP90AA1LMNASMN1; SMN2KDM4E
SCHEMBL31429687 0.83 AMY1A (0.42) IDO1NPC1AMY1A
SCHEMBL31429647 0.83 GRK6 (0.43) IDO1LMNASMN1; SMN2NPC1CASP3
SCHEMBL31429699 0.81 SMN1; SMN2 (0.39) IDO1SMN1; SMN2KDM4ENPC1RAB9A
SCHEMBL31429725 0.81 IDO1 (0.41) IDO1HSP90AA1KDM4EPIM1ALDH1A1
SCHEMBL31429589 0.79 MGAM (0.47) LMNASMN1; SMN2KDM4ENPC1CASP3
SCHEMBL31429625 0.79 DCUN1D1 (0.45) IDO1LMNASMN1; SMN2KDM4ENPC1
SCHEMBL31429708 0.76 AMY1A (0.46) NPC1ALDH1A1MAPTHPGDHTT
SCHEMBL24088767 0.76 POLB (0.41) LMNANPC1MEN1KMT2AMAPT
SCHEMBL23778664 0.75 CXCR2 (0.42) SMN1; SMN2MEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2026-04-23 US disclosed
WO-2025121026-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, RESIN FILM, AND SEMICONDUCTOR DEVICE 旭化成株式会社 2025-06-12 WO disclosed
WO-2025058018-A1 COMPOUND 旭化成株式会社 2025-03-20 WO disclosed
WO-2025009354-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE 旭化成株式会社 2025-01-09 WO disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260109849-A1 EPOXY RESIN COMPOSITION, RESIN PASTE, FILM-TYPE ADHESIVE, PRINTED WIRING BOARD, SEMICONDUCTOR CHIP PACKAGE, AND ELECTRONIC DEVICE ASH2L, DOT1L, ASH1L IDO1 3261/4885HSP90AA1 1980/4885LMNA 3009/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.