Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2C19 | P33261 | 1/20 | 0.34 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.32 |
| ▸ | MAPT | P10636 | 2/20 | 0.32 |
| ▸ | CYP4F2 | P78329 | 1/20 | 0.31 |
| ▸ | CYP4A11 | Q02928 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12822139 | 0.87 | NPSR1 (0.43) | CYP2C19NPSR1MAPTCYP4F2CYP4A11 | |
| SCHEMBL15519662 | 0.87 | NPSR1 (0.43) | CYP2C19NPSR1MAPTCYP4F2CYP4A11 | |
| SCHEMBL1063404 | 0.86 | CYP2C19 (0.40) | CYP2C19NPSR1MAPT | |
| SCHEMBL29184375 | 0.81 | NPSR1 (0.40) | CYP2C19NPSR1MAPTCYP4F2CYP4A11 | |
| SCHEMBL988593 | 0.80 | CYP1A2 (0.38) | CYP2C19NPSR1 | |
| SCHEMBL1247340 | 0.78 | CYP2C19 (0.34) | CYP2C19 | |
| SCHEMBL11757280 | 0.76 | APLNR (0.31) | — | |
| SCHEMBL3681913 | 0.74 | CYP2C19 (0.31) | CYP2C19MAPT | |
| SCHEMBL9034015 | 0.73 | CYP1A2 (0.34) | CYP2C19 | |
| SCHEMBL2357465 | 0.73 | KDM4E (0.40) | CYP2C19NPSR1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110770202-B | Active ester resin, and composition and cured product using same | DIC株式会社 | 2022-12-16 | — | — | CN | disclosed |
| CN-113840885-B | Antifouling coating composition | 日东化成株式会社 | 2022-11-15 | — | — | CN | disclosed |
| CN-109843994-B | Sheet-like prepreg | 株式会社大赛璐 | 2022-10-14 | — | — | CN | disclosed |
| CN-107266661-B | Curable resin composition and cured product thereof | 株式会社大赛璐 | 2022-09-02 | — | — | CN | disclosed |
| CN-114901468-A | Laminate, method for producing same, and automotive exterior material | 三菱化学株式会社 | 2022-08-12 | — | — | CN | disclosed |
| CN-114901752-A | UV resistant surfacing material for composite parts | 塞特工业公司 | 2022-08-12 | — | — | CN | disclosed |
| CN-110770203-B | Active ester compound, and composition and cured product using same | DIC株式会社 | 2022-07-15 | — | — | CN | disclosed |
| CN-114762104-A | Underfill film for semiconductor package and method for manufacturing semiconductor package using same | 株式会社斗山 | 2022-07-15 | — | — | CN | disclosed |
| CN-110483741-B | Tetramethyldiphenol type epoxy resin, epoxy resin composition, cured product, and semiconductor encapsulating material | 三菱化学株式会社 | 2022-07-12 | — | — | CN | disclosed |
| CN-111479889-B | Adhesive, laminate, battery packaging material, and battery | DIC株式会社 | 2022-06-07 | — | — | CN | disclosed |
| US-20090233228-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-09-17 | — | — | US | disclosed |
| US-20090202794-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | ASAHI KASEI EMD CORPORATION (JP) | 2009-08-13 | — | — | US | disclosed |
| EP-2056163-A1 | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION | Asahi Kasei EMD Corporation (JP) | 2009-05-06 | — | — | EP | disclosed |
| US-7252886-B2 | Curable composition and process for producing cured fluorinated product | ASAHI GLASS COMPANY, LIMITED (JP) | 2007-08-07 | — | — | US | disclosed |
| US-20060281883-A1 | Curable composition and process for producing cured fluorinated product | ASAHI GLASS COMPANY LIMITED (JP) | 2006-12-14 | — | — | US | disclosed |
| EP-1724291-A1 | CURABLE COMPOSITION AND PROCESS FOR PRODUCING CURED FLUOROCHEMICAL | Asahi Glass Company, Limited (JP) | 2006-11-22 | — | — | EP | disclosed |
| US-6645632-B2 | Blend of polyimide and epoxy resin | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-11-11 | — | — | US | disclosed |
| US-20010031828-A1 | Film-type adhesive for electronic components, and electronic components bonded therewith | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2001-10-18 | — | — | US | disclosed |
| US-5854371-A | Phosphorus-modified epoxy resin mixtures comprising epoxy resins, phosphorus-containing compounds and a curing agent | HOECHST AKTIENGESELLSCHAFT (DE) | 1998-12-29 | — | — | US | disclosed |
| US-5773533-A | Epoxy resin reacted with carboxy-functional phosphinic or phosphonic acid and hardener | HOECHST AKTIENGESELLSCHAFT (DE) | 1998-06-30 | — | — | US | disclosed |