SCHEMBL3147124

SCHEMBL3147124

O=C(O)C1(Cl)CC=CCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11536961 0.90 FFAR3 (0.32)
SCHEMBL11536305 0.85
SCHEMBL11535359 0.82
SCHEMBL2488949 0.73 FFAR3 (0.31)
SCHEMBL28489123 0.73 FFAR3 (0.31)
SCHEMBL29031913 0.73 FFAR3 (0.31)
SCHEMBL22324 0.70
SCHEMBL13744568 0.70
SCHEMBL20581197 0.70 NSD2 (0.39)
SCHEMBL22436304 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101495919-B Positive photosensitive resin composition, method for preparing cured relief pattern, semiconductor device ASAHI KASEI E MATERIALS CORP 2015-05-06 CN disclosed
US-7687208-B2 Positive photosensitive resin composition ASAHI KASEI EMD CORPORATION (JP) 2010-03-30 US disclosed
US-7674566-B2 Positive photosensitive resin composition ASAHI KASEI EMD CORPORATION (JP) 2010-03-09 US disclosed
US-20090233228-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION ASAHI KASEI EMD CORPORATION (JP) 2009-09-17 US disclosed
US-20090202794-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION ASAHI KASEI EMD CORPORATION (JP) 2009-08-13 US disclosed
CN-101495919-A Positive photosensitive resin composition ASAHI KASEI EMD CORP (JP) 2009-07-29 CN disclosed
EP-2056163-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2009-05-06 EP disclosed
US-7416822-B2 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2008-08-26 US disclosed
US-20070154843-A1 Resin and resin composition ASAHI KASEI EMD CORPORATION (JP) 2007-07-05 US disclosed
EP-1707588-A1 RESIN AND RESIN COMPOSITION Asahi Kasei EMD Corporation (JP) 2006-10-04 EP disclosed
US-6657031-B1 Curable; polyepoxide reworkable through thermal decomposition; printed circuits, semiconductors LOCTITE CORPORATION 2003-12-02 US disclosed
US-4664929-A ARTIFICIAL SWEETENERS GENERAL FOODS CORPORATION (US) 1987-05-12 US disclosed
US-4633006-A ARTIFICIAL SWEETENERS GENERAL FOODS CORPORATION (US) 1986-12-30 US disclosed
US-4141991-A Ferrocene derivatives HOECHST AKTIENGESELLSCHAFT (DE) 1979-02-27 US disclosed
US-4142051-A Arylaminoimidazoline derivatives CHEMIE LINZ AKTIENGESELLSCHAFT (AT) 1979-02-27 US disclosed
US-4001218-A BACTERICIDES BAYER AKTIENGESELLSCHAFT (DT) 1977-01-04 US disclosed
US-3982011-A ANTIBIOTICS, ANIMAL GROWTH PROMOTERS BAYER AKTIENGESELLSCHAFT (DT) 1976-09-21 US disclosed
US-3931153-A BACTERICIDE BAYER AKTIENGESELLSCHAFT (DT) 1976-01-06 US disclosed