Heptanoate

Heptanoate

SCHEMBL3151927

CCCCCCC(=O)O.[AlH3]

nearest known ligand 0.94

Full drug profile on Sugi Atlas →

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ GPR84 Q9NQS5 7/20 0.94
▸ PPARG P37231 7/20 0.94
▸ PPARD Q03181 7/20 0.94
▸ PPARA Q07869 7/20 0.94
▸ HDAC11 Q96DB2 5/20 0.94
▸ TSHR P16473 4/20 0.94
▸ PTPN1 P18031 3/20 0.94
▸ FABP4 P15090 3/20 0.94
▸ ALDH1A1 P00352 2/20 0.94
▸ TLR2 O60603 2/20 0.94
▸ TDP1 Q9NUW8 2/20 0.94
▸ KMT2A Q03164 2/20 0.94
▸ ALOX15 P16050 2/20 0.94
▸ HSD17B10 Q99714 2/20 0.94
▸ SLC22A6 Q4U2R8 1/20 0.94
▸ SLC22A8 Q8TCC7 1/20 0.94
▸ MEN1 O00255 1/20 0.94
▸ ESR1 P03372 1/20 0.94
▸ PDE4A P27815 1/20 0.94
▸ PDE3A Q14432 1/20 0.94

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hexacosanoic Acid SCHEMBL20299557 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Decanoic Acid SCHEMBL2920268 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Palmitic Acid SCHEMBL138024 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Lignoceric Acid SCHEMBL18429966 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Stearic Acid SCHEMBL21996124 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Stearic Acid SCHEMBL8197156 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Octanoic Acid SCHEMBL195241 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL5963311 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Stearic Acid SCHEMBL1713046 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11
Myristic Acid SCHEMBL628569 1.00 GPR84 (0.94) GPR84PPARGPPARDPPARAHDAC11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116970659-B Method for producing polyhydroxyalkanoate 清华大学 2024-02-09 — — CN claimed
WO-2025060941-A1 METHOD FOR PRODUCING POLYHYDROXYALKANOATE 清华大学 2025-03-27 — — WO disclosed
CN-116970659-B Method for producing polyhydroxyalkanoate 清华大学 2024-02-09 — — CN disclosed
CN-116991050-A Liquid powdered ink 乐凯华光印刷科技有限公司 2023-11-03 — — CN disclosed
CN-116970659-A Method for producing polyhydroxyalkanoate 清华大学 2023-10-31 — — CN disclosed
CN-114425324-A Heavy oil hydrodemetallization catalyst and application thereof 中国石油化工股份有限公司 2022-05-03 — — CN disclosed
CN-114425378-A Hydrogenation protection catalyst and application thereof 中国石油化工股份有限公司 2022-05-03 — — CN disclosed
CN-114425351-A Heavy oil hydrogenation catalyst, preparation method thereof and heavy oil hydrogenation treatment method 中国石油化工股份有限公司 2022-05-03 — — CN disclosed
CN-114425352-A Heavy oil hydrogenation catalyst containing halogen, preparation method thereof and heavy oil hydrogenation treatment method 中国石油化工股份有限公司 2022-05-03 — — CN disclosed
CN-108291016-B Polycarbonate resin, method for producing same, and film 帝人株式会社 2021-08-17 — — CN disclosed
EP-2151456-B1 PROCESS FOR PRODUCTION OF THERMALLY EXPANDABLE BEADS AND APPLICATION THEREOF MATSUMOTO YUSHI SEIYAKU KK (JP) 2012-07-11 — — EP disclosed
US-8206826-B2 Method for producing heat-expandable microspheres and application thereof MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2012-06-26 — — US disclosed
US-20100120929-A1 METHOD FOR PRODUCING HEAT-EXPANDABLE MICROSPHERES AND APPLICATION THEREOF MATSUMOTO YUSHI-SEIYAKU CO., LTD. (JP) 2010-05-13 — — US disclosed
EP-2151456-A1 PROCESS FOR PRODUCTION OF THERMALLY EXPANDABLE BEADS AND APPLICATION THEREOF Matsumoto Yushi-Seiyaku CO., LTD. (JP) 2010-02-10 — — EP disclosed
US-6830704-B2 Contains a Lewis acid metal salt and a compound having clathrating ability. TOAGOSEI CO., LTD. (JP) 2004-12-14 — — US disclosed
US-20030135016-A1 Contains a Lewis acid metal salt and a compound having clathrating ability. TOAGOSEI CO., LTD. 2003-07-17 — — US disclosed
US-6547985-B1 Adhesive mixture TOGOSEI CO., LTD. (JP) 2003-04-15 — — US disclosed
US-6017995-A AN AQUEOUS SUSPENSION COMPRISING MICA, AT LEAST ONE SILANE, A POLYSILOXANE, A COMPOUND CATALYZING THE HYDROLYSIS AND/OR COUPLING REACTION AND ADDITIVES; IMPROVING THE FORMED SHEET MECHANICAL AND ELECTRICAL PROPERTIES WACKER-CHEMIE GMBH (DE) 2000-01-25 — — US disclosed
US-5708113-A FORMING SOLVENT-FREE MICA INSULATING MATERIALS HUELS SILICONE GMBH (DE) 1998-01-13 — — US disclosed
US-5463086-A Dissolving a crude lactide in a weak and strong solvent mixture then recrystallizing DAINIPPON INK AND CHEMICALS, INC. (JP) 1995-10-31 — — US disclosed
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