Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGAM | O43451 | 1/20 | 0.46 |
| ▸ | GAA | P10253 | 1/20 | 0.46 |
| ▸ | SI | P14410 | 1/20 | 0.46 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 3/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28830208 | 0.89 | GAA (0.47) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL28681490 | 0.79 | MGAM (0.43) | MGAMGAASIMGAM2ALDH1A1 | |
| SCHEMBL472554 | 0.77 | TSHR (0.50) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL30059382 | 0.77 | TSHR (0.50) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL2592643 | 0.77 | — | — | |
| SCHEMBL609208 | 0.75 | MGAM (0.67) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL13719657 | 0.75 | MGAM (0.52) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL14342951 | 0.74 | TSHR (0.39) | TSHRALDH1A1TDP1 | |
| SCHEMBL16058838 | 0.73 | TSHR (0.40) | TSHRALDH1A1TDP1 | |
| SCHEMBL6675736 | 0.73 | MGAM (0.50) | MGAMGAASIMGAM2TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119708845-A | Single-component heat-conducting organic silica gel composition and preparation method thereof | 浙江励德有机硅材料有限公司 | 2025-03-28 | — | — | CN | claimed |
| CN-119708845-A | Single-component heat-conducting organic silica gel composition and preparation method thereof | 浙江励德有机硅材料有限公司 | 2025-03-28 | — | — | CN | disclosed |