Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGAM | O43451 | 2/20 | 0.67 |
| ▸ | GAA | P10253 | 2/20 | 0.67 |
| ▸ | SI | P14410 | 2/20 | 0.67 |
| ▸ | MGAM2 | Q2M2H8 | 2/20 | 0.67 |
| ▸ | TSHR | P16473 | 5/20 | 0.40 |
| ▸ | HTT | P42858 | 1/20 | 0.39 |
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.39 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.38 |
| ▸ | KDM6B | O15054 | 1/20 | 0.38 |
| ▸ | KDM5C | P41229 | 1/20 | 0.38 |
| ▸ | EGLN1 | Q9GZT9 | 1/20 | 0.38 |
| ▸ | PHF8 | Q9UPP1 | 1/20 | 0.38 |
| ▸ | KDM2A | Q9Y2K7 | 1/20 | 0.38 |
| ▸ | TRPA1 | O75762 | 1/20 | 0.37 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 4/20 | 0.33 |
| ▸ | CES2 | O00748 | 1/20 | 0.32 |
| ▸ | SLC15A2 | Q16348 | 1/20 | 0.32 |
| ▸ | CA2 | P00918 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2812474 | 0.91 | MGAM (0.57) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL9436391 | 0.88 | MGAM (0.60) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL8364037 | 0.85 | — | — | |
| SCHEMBL18832117 | 0.83 | PHF8 (0.54) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL29071013 | 0.83 | MGAM (0.48) | MGAMGAASIMGAM2TSHR | |
| Propionic Acid SCHEMBL28557464 | 0.83 | MGAM (0.48) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL727178 | 0.83 | ALDH1A1 (0.48) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL13719657 | 0.81 | MGAM (0.52) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL7638055 | 0.81 | MGAM (0.52) | MGAMGAASIMGAM2TSHR | |
| SCHEMBL2874791 | 0.81 | MGAM (0.46) | MGAMGAASIMGAM2TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 47 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-1090210-A | — | — | None | — | — | JP | disclosed |
| JP-7228799-A | — | — | None | — | — | JP | disclosed |
| CN-119452740-A | Structure and wiring board | 太阳控股株式会社 | 2025-02-14 | — | — | CN | disclosed |
| WO-2023238925-A1 | RADICAL POLYMERIZABLE COMPOSITION AND POLYMERIZED PRODUCT THEREOF | 株式会社日本触媒 | 2023-12-14 | — | — | WO | disclosed |
| CN-111655662-B | Compound, resin, composition, resist pattern forming method, circuit pattern forming method, and resin purifying method | 三菱瓦斯化学株式会社 | 2023-09-26 | — | — | CN | disclosed |
| CN-114829381-A | Genetically modified plants and methods for making the same | 恩派瑞安神经科学公司 | 2022-07-29 | — | — | CN | disclosed |
| CN-110651004-B | Conductive resin composition and method for manufacturing shield package using same | 拓自达电线株式会社 | 2022-03-25 | — | — | CN | disclosed |
| US-20210301129-A1 | POLY(PHENYLENE ETHER), CURABLE COMPOSITION CONTAINING POLY(PHENYLENE ETHER), DRY FILM, PREPREG, CURED OBJECT, LAMINATE, AND ELECTRONIC COMPONENT | TAIYO HOLDINGS CO., LTD. (JP) | 2021-09-30 | — | — | US | disclosed |
| CN-112996839-A | Material for forming film for lithography, composition for forming film for lithography, underlayer film for lithography, and pattern formation method | 三菱瓦斯化学株式会社 | 2021-06-18 | — | — | CN | disclosed |
| CN-110302727-B | Millimeter-sized microcapsule and preparation method thereof | 江南大学 | 2020-11-06 | — | — | CN | disclosed |
| US-20070049655-A1 | Radiation-curable composition and cured product thereof | NIPPON SHOKUBAI CO., LTD. (JP) | 2007-03-01 | — | — | US | disclosed |
| US-20060231525-A1 | Forming microphase-separated structure in film of graft or block copolymer with a chain of polyacrylonitrile, polycyclohexadiene derivative, polybutadiene, polysilane, polysiloxane, polyamic acid or polyaniline and thermally decomposable polymer chain; heating to decompose the decomposable phase; etching | ASAKAWA KOJI | 2006-10-19 | — | — | US | disclosed |
| US-7097781-B2 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2006-08-29 | — | — | US | disclosed |
| US-7090784-B2 | Forming pattern using graft polymer containing metal particles; overcoating substrates; removal polymer | KABUSHIKI KAISHA TOSHIBA (JP) | 2006-08-15 | — | — | US | disclosed |
| US-20040050816-A1 | Forming pattern using graft polymer containing metal particles; overcoating substrates; removal polymer | KABUSHIKI KAISHA TOSHIBA (JP) | 2004-03-18 | — | — | US | disclosed |
| US-20030222048-A1 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-12-04 | — | — | US | disclosed |
| US-6565763-B1 | Method for manufacturing porous structure and method for forming pattern | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-05-20 | — | — | US | disclosed |
| JP-H07228799-A | COATING RESIN COMPOSITION | AICA KOGYO CO LTD | 1995-08-29 | — | — | JP | disclosed |
| JP-S6490210-A | HARD COATING COMPOSITION AND ITS CURE | KAYAKU NOURY CORP | 1989-04-06 | — | — | JP | disclosed |
| US-4413072-A | Mixtures of polyurethanes and unsaturated polyester resins | BAYER AKTIENGESELLSCHAFT (DE) | 1983-11-01 | — | — | US | disclosed |