SCHEMBL31574434

SCHEMBL31574434

Cc1cc(C(=O)Oc2cc(OC(=O)c3ccc(O)c(C)c3)cc(OC(=O)c3ccc(O)c(C)c3)c2)ccc1O

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 8/20 0.50
CA12 O43570 3/20 0.47
CA1 P00915 3/20 0.47
CA2 P00918 3/20 0.47
CA7 P43166 3/20 0.47
CA9 Q16790 3/20 0.47
CA14 Q9ULX7 3/20 0.47
XDH P47989 1/20 0.47
NR1H4 Q96RI1 1/20 0.44
NSD2 O96028 1/20 0.43
CYP1A2 P05177 3/20 0.43
CYP2C9 P11712 3/20 0.43
MAPT P10636 5/20 0.43
POLB P06746 2/20 0.43
HSD17B2 P37059 1/20 0.42
ALDH1A1 P00352 3/20 0.42
MEN1 O00255 4/20 0.42
TP53 P04637 2/20 0.42
HPGD P15428 2/20 0.42
ALOX15 P16050 2/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31574453 0.93 CA12 (0.46) KMT2ACA12CA1CA2CA7
SCHEMBL31574446 0.93 CA12 (0.46) KMT2ACA12CA1CA2CA7
SCHEMBL767373 0.91 NR1H4 (0.54) KMT2ACA12CA1CA2CA7
SCHEMBL767642 0.88 KMT2A (0.50) KMT2ACA12CA1CA2CA7
SCHEMBL28069018 0.85 NR1H4 (0.59) KMT2ACA12CA1CA2CA7
SCHEMBL172476 0.81 CA1 (0.71) KMT2ACA12CA1CA2CA7
SCHEMBL767555 0.81 NR1H4 (0.55) KMT2ACA12CA1CA2CA7
SCHEMBL19621079 0.81 KMT2A (0.58) KMT2ANR1H4CYP1A2CYP2C9ALDH1A1
SCHEMBL19630948 0.80 NR1H4 (0.54) KMT2ACA1CA2NR1H4CYP1A2
SCHEMBL768259 0.79 HSD17B2 (0.60) KMT2ANR1H4CYP1A2MAPTPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120019086-A Vinyl compound, vinyl composition, cured vinyl resin, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and printed wiring board 住友化学株式会社 2025-05-16 CN disclosed