SCHEMBL31574442

SCHEMBL31574442

Cc1cc(C(=O)C2CC(C(=O)c3ccc(O)cc3)CC(C(=O)c3ccc(O)cc3)C2)ccc1O

nearest known ligand 0.45

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
HTT P42858 2/20 0.45
SMN1; SMN2 Q16637 1/20 0.45
DYRK1A Q13627 1/20 0.43
DYRK1B Q9Y463 1/20 0.43
MEN1 O00255 2/20 0.41
KMT2A Q03164 2/20 0.41
CYP2D6 P10635 1/20 0.41
BACE1 P56817 1/20 0.40
MGLL Q99685 4/20 0.40
HSD17B1 P14061 4/20 0.39
HSD17B2 P37059 4/20 0.39
ESR1 P03372 1/20 0.39
ESR2 Q92731 1/20 0.39
TAS1R3 Q7RTX0 1/20 0.38
TAS1R1 Q7RTX1 1/20 0.38
TP53 P04637 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
KDM2B Q8NHM5 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31574439 1.00 HTT (0.45) HTTSMN1; SMN2DYRK1ADYRK1BMEN1
SCHEMBL31574443 0.93 TDP1 (0.42) HTTSMN1; SMN2DYRK1ADYRK1BMEN1
SCHEMBL15851142 0.83 MEN1 (0.49) DYRK1ADYRK1BMEN1KMT2ACYP2D6
SCHEMBL31574435 0.82 HTT (0.50) HTTMGLLHSD17B1ESR1ESR2
SCHEMBL15851060 0.79 SRD5A2 (0.50) SMN1; SMN2MEN1KMT2ACYP2D6TAS1R3
SCHEMBL1758781 0.75 HTT (0.75) HTTSMN1; SMN2DYRK1ADYRK1BMEN1
4-Hydroxyacetophenone SCHEMBL9828495 0.74 HSD17B1 (0.59) HTTSMN1; SMN2DYRK1ADYRK1BBACE1
Paraben SCHEMBL8851014 0.74 CA12 (0.61) HTTSMN1; SMN2DYRK1ADYRK1BMEN1
SCHEMBL31574438 0.74 KMT2A (0.49) HTTSMN1; SMN2DYRK1ADYRK1BMEN1
SCHEMBL31574431 0.74 KMT2A (0.49) HTTSMN1; SMN2DYRK1ADYRK1BMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120019086-A Vinyl compound, vinyl composition, cured vinyl resin, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and printed wiring board 住友化学株式会社 2025-05-16 CN disclosed