SCHEMBL31574448

SCHEMBL31574448

Cc1cc(-c2cc(-c3ccc(O)c(C)c3)cc(-c3ccc(O)c(C)c3)c2)ccc1O

nearest known ligand 0.63

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
HSD17B1 P14061 7/20 0.63
HSD17B2 P37059 7/20 0.63
ESR2 Q92731 4/20 0.61
TP53 P04637 1/20 0.56
TDP1 Q9NUW8 1/20 0.56
PDE10A Q9Y233 1/20 0.52
FGFR1 P11362 1/20 0.52
ESR1 P03372 4/20 0.50
APP P05067 2/20 0.50
CA1 P00915 1/20 0.50
CA2 P00918 1/20 0.50
CYP3A4 P08684 2/20 0.48
CYP2D6 P10635 2/20 0.48
CYP2C19 P33261 2/20 0.48
MCL1 Q07820 1/20 0.48
AR P10275 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL675046 1.00 HSD17B1 (0.63) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL29696046 0.95 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL26979937 0.95 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL29429121 0.95 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL272034 0.95 HSD17B1 (0.68) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL3811825 0.92 HSD17B1 (0.72) HSD17B1HSD17B2ESR2TP53TDP1
Hydrogen Sulfide SCHEMBL6269773 0.92 HSD17B1 (0.65) HSD17B1HSD17B2ESR2TP53TDP1
Hydrogen Sulfide SCHEMBL22042810 0.92 HSD17B1 (0.65) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL13589555 0.92 HSD17B1 (0.72) HSD17B1HSD17B2ESR2TP53TDP1
SCHEMBL31574433 0.91 HSD17B1 (0.66) HSD17B1HSD17B2ESR2TP53TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-120019086-A Vinyl compound, vinyl composition, cured vinyl resin, prepreg, resin-coated film, resin-coated metal foil, metal-clad laminate, and printed wiring board 住友化学株式会社 2025-05-16 CN disclosed