SCHEMBL315995

SCHEMBL315995

C=C(C)C(=O)OC1(C2CO2)CC1.C=COC(C)=O

nearest known ligand 0.36

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid Methyl Ester SCHEMBL3399988 0.91 ALDH1A1 (0.31) ALDH1A1
SCHEMBL109019 0.88 ALDH1A1 (0.44) ALDH1A1
Acrylic Acid SCHEMBL7638498 0.85 ALDH1A1 (0.38) ALDH1A1
SCHEMBL9805232 0.84
Methacrylic Acid SCHEMBL7627602 0.83 ALDH1A1 (0.41) ALDH1A1
SCHEMBL4221450 0.82 ALDH1A1 (0.48) ALDH1A1
Acrylic Acid Methyl Ester SCHEMBL316361 0.82 ALDH1A1 (0.36) ALDH1A1
SCHEMBL9421689 0.81 ALDH1A1 (0.44) ALDH1A1
Acrylic Acid Ethyl Ester SCHEMBL315711 0.79 ALDH1A1 (0.39) ALDH1A1
SCHEMBL324857 0.78 ALDH1A1 (0.38) ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 219 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117603555-B High-heat-conductivity high-toughness epoxy resin composite material and preparation method and application thereof 四川大学 2024-03-22 CN claimed
CN-117603555-A High-heat-conductivity high-toughness epoxy resin composite material and preparation method and application thereof 四川大学 2024-02-27 CN claimed
US-20230257574-A1 RESIN AQUEOUS DISPERSION COMPOSITION SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) 2023-08-17 US claimed
EP-4183829-A1 RESIN AQUEOUS DISPERSION COMPOSITION Sumitomo Seika Chemicals Co., Ltd. (JP) 2023-05-24 EP claimed
CN-114729153-A Aliphatic copolyester composition with improved impact resistance and weather resistance 伊士曼化工公司 2022-07-08 CN claimed
WO-2021102135-A1 ALIPHATIC COPOLYESTERS COMPOSITIONS WITH IMPROVED IMPACT AND WEATHER RESISTANCE EASTMAN CHEMICAL COMPANY (US) 2021-05-27 WO claimed
US-20210155795-A1 ALIPHATIC COPOLYESTERS COMPOSITIONS WITH IMPROVED IMPACT AND WEATHER RESISTANCE EASTMAN CHEMICAL COMPANY (US) 2021-05-27 US claimed
CN-108702840-B Resin-coated metal foil and flexible printed wiring board 松下知识产权经营株式会社 2021-05-07 CN claimed
CN-108605416-B Multilayer printed wiring board and multilayer metal-clad laminate 松下知识产权经营株式会社 2021-04-27 CN claimed
US-20120271001-A1 COMPOSITION OF POLYKETONE WITH HIGH IMPACT STRENGTH HYUNDAI MOTOR COMPANY (KR) 2012-10-25 US claimed
EP-1704996-B1 Fuel cell hose TOKAI RUBBER IND LTD (JP) 2011-02-09 EP claimed
US-20090197083-A1 HEAT-RESISTANT RESIN COMPOSITION AND INSULATED WIRE INSULATED THEREWITH HITACHI METALS, LTD. (JP) 2009-08-06 US claimed
EP-0180648-B1 POLYESTER COMPOSITION AND MOLDINGS THEREOF TORAY INDUSTRIES, INC. (JP) 1992-09-16 EP claimed
EP-0039749-A2 Process for production of hydration product of ethylene-glycidyl acrylate compound copolymer and use of the product as an interlayer for laminated glass, and in compositions for powder coating SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 1981-11-18 EP claimed
JP-56118269-A None JP disclosed
JP-6287325-A None JP disclosed
JP-59214620-A None JP disclosed
US-4461871-A Polyester resinous composition, molded articles and process for preparation thereof TORAY INDUSTRIES, INC. (JP) 1984-07-24 US disclosed
EP-0072455-A1 Polyester resinous composition and process for preparing thereof TORAY INDUSTRIES, INC. (JP) 1983-02-23 EP disclosed
JP-S56118269-A THIN BATTERY HITACHI MAXELL LTD 1981-09-17 JP disclosed