SCHEMBL316938

SCHEMBL316938

[CH2]C([O])=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL712303 0.77
SCHEMBL7211163 0.76
SCHEMBL3676073 0.71
Bicarbonate SCHEMBL6065486 0.71 CA1 (0.71)
Bicarbonate SCHEMBL20650 0.71
Bicarbonate SCHEMBL3629001 0.71
Bicarbonate SCHEMBL177966 0.71 CA1 (0.71)
Bicarbonate SCHEMBL3974066 0.71 CA1 (0.71)
Bicarbonate SCHEMBL10831385 0.71 CA1 (0.71)
Bicarbonate SCHEMBL968687 0.71 CA1 (0.71)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 269 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 US claimed
CN-113820920-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2023-07-04 CN claimed
CN-113820920-A Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-12-21 CN claimed
CN-107850844-B Photosensitive resin composition, method for producing cured relief pattern, and semiconductor device 旭化成株式会社 2021-09-07 CN claimed
US-20200409263-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-12-31 US claimed
US-10831101-B2 Photosensitive resin composition, method for manufacturing cured relief pattern, and semiconductor apparatus ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-11-10 US claimed
US-20190113845-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-04-18 US claimed
EP-1921063-B1 INDOLE COMPOUND, OPTICAL FILTER AND OPTICAL RECORDING MATERIAL ADEKA CORP (JP) 2010-09-01 EP claimed
EP-0992512-B1 Reduced cortisol conjugate ORTHO CLINICAL DIAGNOSTICS INC (US) 2005-12-14 EP claimed
US-6383766-B1 FOR USE AS IMMUNOGENS AND HAPTENS; FOR USE IN IMMUNOASSAYS ORTHO-CLINICAL DIAGNOSTICS, INC. 2002-05-07 US claimed
EP-0690847-A1 HETEROCYCLIC COMPOUNDS AS PLATELET AGGREGATION INHIBITORS ZENECA LIMITED (GB) 1996-01-10 EP claimed
US-5453414-A 2-arylpyrimidines and herbicidal use thereof ROHM AND HAAS COMPANY (US) 1995-09-26 US claimed
WO-1994022835-A2 HETEROCYCLIC COMPOUNDS AS PLATELET AGGREGATION INHIBITORS ZENECA LIMITED (GB) 1994-10-13 WO claimed
WO-1994022834-A1 HETEROCYCLIC DERIVATIVES AS PLATELET AGGREGATION INHIBITORS ZENECA LIMITED (GB) 1994-10-13 WO claimed
US-5300477-A 2-arylpyrimidines and herbicidal use thereof ROHM AND HAAS COMPANY (US) 1994-04-05 US claimed
EP-0579424-A1 2-substituted pyrimidines and herbicidal use thereof ROHM AND HAAS COMPANY (US) 1994-01-19 EP claimed
US-5272077-A Method for preparing a covalent conjugate of an oligonucleotide and an enzyme EASTMAN KODAK COMPANY (US) 1993-12-21 US claimed
US-5254469-A Oligonucleotide-enzyme conjugate that can be used as a probe in hybridization assays and polymerase chain reaction procedures EASTMAN KODAK COMPANY (US) 1993-10-19 US claimed
EP-0021695-B1 NOVEL NONLINEAR OPTICAL MATERIALS AND PROCESSES EMPLOYING DIACETYLENES UNIVERSITY PATENTS, INC. (US) 1986-11-12 EP claimed
US-4379838-A Photosensitive photographic recording material comprising a dyed layer AGFA-GEVAERT AKTIENGESELLSCHAFT (DE) 1983-04-12 US claimed