Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | POLB | P06746 | 1/20 | 0.49 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.47 |
| ▸ | MAPT | P10636 | 2/20 | 0.47 |
| ▸ | PKM | P14618 | 2/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.47 |
| ▸ | MEN1 | O00255 | 2/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.47 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.47 |
| ▸ | GPR84 | Q9NQS5 | 4/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL784230 | 1.00 | POLB (0.49) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL9721067 | 1.00 | POLB (0.49) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL10336405 | 0.98 | POLB (0.50) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL9198468 | 0.94 | KMT2A (0.49) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL784231 | 0.88 | TDP1 (0.59) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL3170850 | 0.88 | TDP1 (0.59) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL9721071 | 0.88 | TDP1 (0.59) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL10030890 | 0.88 | TDP1 (0.49) | POLBKMT2ATDP1KDM4E | |
| SCHEMBL10336406 | 0.87 | TDP1 (0.60) | POLBKMT2AMAPTPKMTDP1 | |
| SCHEMBL10765180 | 0.85 | MAPT (0.50) | POLBKMT2AMAPTPKMTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-5173130-A | Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating | SHIKOKU CHEMICALS CORPORATION (JP) | 1992-12-22 | — | — | US | claimed |
| US-20250215572-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | SHIKOKU CHEMICALS CORPORATION (JP) | 2025-07-03 | — | — | US | disclosed |
| EP-4506488-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | Shikoku Chemicals Corporation (JP) | 2025-02-12 | — | — | EP | disclosed |
| WO-2023190263-A1 | SURFACE TREATMENT AGENT FOR COPPER OR COPPER ALLOY | 四国化成工業株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-111527593-B | Method for manufacturing electronic device | 住友电木株式会社 | 2021-05-04 | — | — | CN | disclosed |
| CN-111527593-A | Method for manufacturing electronic device | 住友电木株式会社 | 2020-08-11 | — | — | CN | disclosed |
| EP-3188577-B1 | METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE | ROHM & HAAS ELECT MAT (US) | 2019-01-30 | — | — | EP | disclosed |
| EP-3188577-A1 | METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE | Rohm and Haas Electronic Materials LLC (US) | 2017-07-05 | — | — | EP | disclosed |
| US-20170183783-A1 | METHOD FOR FORMING ORGANIC COATING ON COPPER SURFACE | ROHM & HAAS ELECT MAT (US) | 2017-06-29 | — | — | US | disclosed |
| EP-2161354-A1 | COPPER SURFACE TREATING AGENT AND SURFACE TREATMENT METHOD | MEC COMPANY LTD. (JP) | 2010-03-10 | — | — | EP | disclosed |
| US-5173130-A | Immersing copper or alloy to be soldered in an aqueous solution containing a 2-alkylbenzimidazole and an organic acid to form a corrosion and heat resistant protective coating | SHIKOKU CHEMICALS CORPORATION (JP) | 1992-12-22 | — | — | US | disclosed |
| EP-0428383-A1 | Process for surface treatment of copper and copper alloy | SHIKOKU CHEMICALS CORPORATION (JP) | 1991-05-22 | — | — | EP | disclosed |