Predicted protein targets (top 10)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.59 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.57 |
| ▸ | MAPT | P10636 | 2/20 | 0.57 |
| ▸ | PKM | P14618 | 2/20 | 0.57 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.57 |
| ▸ | MEN1 | O00255 | 1/20 | 0.57 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.57 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.51 |
| ▸ | RAB9A | P51151 | 1/20 | 0.50 |
| ▸ | POLB | P06746 | 1/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9721071 | 1.00 | TDP1 (0.59) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL3170850 | 1.00 | TDP1 (0.59) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL10336406 | 0.98 | TDP1 (0.60) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL9198479 | 0.94 | TDP1 (0.62) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL784230 | 0.88 | POLB (0.49) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL3170844 | 0.88 | POLB (0.49) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL9721067 | 0.88 | POLB (0.49) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL19399620 | 0.88 | TDP1 (0.66) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL10336405 | 0.87 | POLB (0.50) | TDP1KMT2AMAPTPKMKDM4E | |
| SCHEMBL9721021 | 0.84 | KMT2A (0.79) | TDP1KMT2AMAPTPKMKDM4E |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9226406-B2 | Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2015-12-29 | — | — | US | disclosed |
| US-8766437-B2 | Electrode structure, wiring body, adhesive connection structure, electronic device, and method for fabricating same | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2014-07-01 | — | — | US | disclosed |
| EP-2440024-B1 | CONNECTION METHOD | SUMITOMO ELECTRIC INDUSTRIES (JP) | 2014-03-12 | — | — | EP | disclosed |
| EP-2445322-B1 | Connection method | SUMITOMO ELECTRIC INDUSTRIES (JP) | 2013-07-10 | — | — | EP | disclosed |
| US-8470438-B2 | Electrode-connecting structure, conductive adhesive used for the same, and electronic apparatus | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2013-06-25 | — | — | US | disclosed |
| EP-2453726-A1 | Connection method, connection structure, and electronic device | Sumitomo Electric Industries, Ltd. (JP) | 2012-05-16 | — | — | EP | disclosed |
| CN-102461349-A | Electrode connection method, electrode connection structure, conductive adhesive used therefor, and electronic device | SUMITOMO ELECTRIC INDUSTRIES | 2012-05-16 | — | — | CN | disclosed |
| CN-102450112-A | Connection method, connection structure, and electronic device | SUMITOMO ELECTRIC INDUSTRIES | 2012-05-09 | — | — | CN | disclosed |
| EP-2445323-A1 | ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE | Sumitomo Electric Industries, Ltd. (JP) | 2012-04-25 | — | — | EP | disclosed |
| EP-2445324-A1 | ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE | Sumitomo Electric Industries, Ltd. (JP) | 2012-04-25 | — | — | EP | disclosed |
| EP-2445322-A1 | Connection method, connection structure, and electronic device | Sumitomo Electric Industries, Ltd. (JP) | 2012-04-25 | — | — | EP | disclosed |
| US-20120085580-A1 | ELECTRODE CONNECTION METHOD, ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2012-04-12 | — | — | US | disclosed |
| US-20120067619-A1 | CONNECTION METHOD, CONNECTION STRUCTURE, AND ELECTRONIC DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2012-03-22 | — | — | US | disclosed |
| CN-102246607-A | Electrode connection structure, conductive adhesive for electrode connection structure, and electronic device | SUMITOMO ELECTRIC INDUSTRIES | 2011-11-16 | — | — | CN | disclosed |
| US-20110250395-A1 | ELECTRODE CONNECTION STRUCTURE, CONDUCTIVE ADHESIVE USED THEREFOR, AND ELECTRONIC DEVICE | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 2011-10-13 | — | — | US | disclosed |
| CN-102132636-A | Electrode structure, wiring body, adhesive connection structure, electronic device and assembling method thereof | SUMITOMO ELECTRIC INDUSTRIES | 2011-07-20 | — | — | CN | disclosed |
| US-20110147048-A1 | ELECTRODE STRUCTURE, WIRING BODY, ADHESIVE CONNECTION STRUCTURE, ELECTRONIC DEVICE, AND METHOD FOR FABRICATING SAME | SUMITOMO ELECTRIC PRINTED CIRCUITS, INC. (JP) | 2011-06-23 | — | — | US | disclosed |
| CN-1287025-A | Coating method for resin type protection composition, glue spreader using the same method and the same composition | MICO CO LTD (JP) | 2001-03-14 | — | — | CN | disclosed |