SCHEMBL3179484

SCHEMBL3179484

O=C1C=CC(=O)N1c1cccc(-c2cccc(N3C(=O)C=CC3=O)c2)c1

nearest known ligand 0.88

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 14/20 0.88
FAAH O00519 8/20 0.88
HSP90AA1 P07900 4/20 0.88
ALDH1A1 P00352 1/20 0.88
PKM P14618 1/20 0.88
HTT P42858 1/20 0.88
ATM Q13315 1/20 0.88
HPN P05981 1/20 0.56
CCR6 P51684 1/20 0.45
BCHE P06276 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4005412 0.94 MGLL (1.00) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL19511361 0.92 MGLL (0.82) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL94730 0.88 MGLL (1.00) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL1838889 0.88 MGLL (1.00) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL28623833 0.88 MGLL (0.76) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30958998 0.86 MGLL (0.95) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL14150139 0.84 MGLL (0.65) MGLLFAAHHSP90AA1ALDH1A1PKM
Water SCHEMBL5808596 0.84 MGLL (0.91) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL25233931 0.83 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM
SCHEMBL30104187 0.83 MGLL (0.64) MGLLFAAHHSP90AA1ALDH1A1PKM

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20220112373-A1 THERMOSETTING RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2022-04-14 US disclosed
US-20210284783-A1 METHODS FOR PRODUCING CURABLE RESIN MIXTURE AND CURABLE RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2021-09-16 US disclosed
US-10689493-B2 Thermosetting resin composition SHOWA DENKO K.K. (JP) 2020-06-23 US disclosed
EP-3613780-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2020-02-26 EP disclosed
EP-3613781-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF Showa Denko K.K. (JP) 2020-02-26 EP disclosed
US-20200031966-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2020-01-30 US disclosed
US-20200031973-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, AND STRUCTURE INCLUDING CURED PRODUCT THEREOF SHOWA DENKO K.K. (JP) 2020-01-30 US disclosed
EP-3239199-B1 THERMOSETTING RESIN COMPOSITION SHOWA DENKO KK (JP) 2019-09-25 EP disclosed
EP-3511363-A1 CURABLE RESIN MIXTURE AND METHOD FOR PRODUCING CURABLE RESIN COMPOSITION Showa Denko K.K. (JP) 2019-07-17 EP disclosed
US-10160856-B2 Thermosetting resin composition SHOWA DENKO K.K. (JP) 2018-12-25 US disclosed
EP-3239200-A1 THERMOSETTING RESIN COMPOSITION Showa Denko K.K. (JP) 2017-11-01 EP disclosed
US-7649027-B2 having juts via photopolymerization in supercritical carbon dioxide; calcining KANSAI PAINT CO., LTD. (JP) 2010-01-19 US disclosed
US-20090023830-A1 POLYMER AND PROCESS FOR PRODUCING POLYMER KANSAI PAINT CO., LTD. (JP) 2009-01-22 US disclosed
EP-1698647-A1 POLYMER AND PROCESS FOR PRODUCING POLYMER KANSAI PAINT CO., LTD. (JP) 2006-09-06 EP disclosed
US-7081486-B2 Method of producing polymer SHIZUOKA UNIVERSITY (JP) 2006-07-25 US disclosed
EP-1598374-A1 METHOD OF PRODUCING POLYMER Japan as represented by President of Shizuoka University (JP) 2005-11-23 EP disclosed
US-20050143481-A1 Method of producing polymer KANSAI PAINT CO., LTD. (JP) 2005-06-30 US disclosed
EP-0451405-B1 Thermosetting resin composition MITSUI TOATSU CHEMICALS (JP) 1994-12-14 EP disclosed
US-5104962-A Also containing bismaleimide groups; toughness, heat resistance MITSUI TOATSU CHEMICALS, INC. (JP) 1992-04-14 US disclosed
EP-0451405-A1 Thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-10-16 EP disclosed