Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3135196 | 0.87 | — | — | |
| SCHEMBL48300 | 0.82 | — | — | |
| SCHEMBL10384897 | 0.82 | — | — | |
| SCHEMBL11058960 | 0.82 | — | — | |
| SCHEMBL9800525 | 0.82 | — | — | |
| SCHEMBL7544345 | 0.82 | — | — | |
| SCHEMBL10383898 | 0.82 | — | — | |
| SCHEMBL2245 | 0.82 | — | — | |
| SCHEMBL18224220 | 0.67 | — | — | |
| SCHEMBL5091413 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20260138927-A1 | FABRICATION OF DOPED TRANSPARENT POLYCRYSTALLINE CERAMIC MATERIALS | CORNING INCORPORATED (US) | 2026-05-21 | — | — | US | claimed |
| CN-120076885-A | Manufacture of doped transparent polycrystalline ceramic materials | 康宁公司 | 2025-05-30 | — | — | CN | claimed |
| WO-2024172834-A2 | FABRICATION OF DOPED TRANSPARENT POLYCRYSTALLINE CERAMIC MATERIALS | CORNING INCORPORATED (US) | 2024-08-22 | — | — | WO | claimed |
| US-20040196620-A1 | Dielectric laminate for a capacitor | SHIPLEY COMPANY, L.L.C. | 2004-10-07 | — | — | US | claimed |
| US-6728092-B2 | Formation of thin film capacitors | SHIPLEY-COMPANY, L.L.C. | 2004-04-27 | — | — | US | claimed |
| US-20020176989-A1 | Dielectric laminate for a capacitor | SHIPLEY COMPANY, L.L.C. | 2002-11-28 | — | — | US | claimed |
| US-6433993-B1 | MULTILAYER; FLEXIBLE METAL LAYER, DIELECTRICS, BARRIER; COMBUSTION VAPOR DEPOSITION | MICROCOATING TECHNOLOGIES, INC. | 2002-08-13 | — | — | US | claimed |
| US-6270835-B1 | PROVIDING THREE-LAYER STRUCTURE COMPRISING DIELECTRIC LAYER AND ELECTRICALLY CONDUCTIVE LAYERS; PATTERNING ELECTRICALLY CONDUCTIVE LAYER TO FORM STRUCTURE; EMBEDDING INTO SECOND DIELECTRIC MATERIAL; PATTERNING ELECTRICALLY CONDUCTIVE LAYER | MICROCOATING TECHNOLOGIES, INC. | 2001-08-07 | — | — | US | claimed |
| EP-1005260-A2 | Formation of thin film capacitors | MicroCoating Technologies, Inc. (US) | 2000-05-31 | — | — | EP | claimed |
| US-20260138927-A1 | FABRICATION OF DOPED TRANSPARENT POLYCRYSTALLINE CERAMIC MATERIALS | CORNING INCORPORATED (US) | 2026-05-21 | — | — | US | disclosed |
| CN-120076885-A | Manufacture of doped transparent polycrystalline ceramic materials | 康宁公司 | 2025-05-30 | — | — | CN | disclosed |
| WO-2024172834-A2 | FABRICATION OF DOPED TRANSPARENT POLYCRYSTALLINE CERAMIC MATERIALS | CORNING INCORPORATED (US) | 2024-08-22 | — | — | WO | disclosed |
| US-8183552-B2 | Semiconductor memory device | KABUSHIKI KAISHA TOSHIBA (JP) | 2012-05-22 | — | — | US | disclosed |
| US-20100038617-A1 | SEMICONDUCTOR MEMORY DEVICE | KABUSHIKI KAISHA TOSHIBA (JP) | 2010-02-18 | — | — | US | disclosed |
| EP-1251530-A2 | Dielectric laminate for a capacitor | Shipley Company LLC (US) | 2002-10-23 | — | — | EP | disclosed |
| US-20020145845-A1 | Formation of thin film capacitors | MICROCOATING TECHNOLOGIES OF (US) | 2002-10-10 | — | — | US | disclosed |
| US-6433993-B1 | MULTILAYER; FLEXIBLE METAL LAYER, DIELECTRICS, BARRIER; COMBUSTION VAPOR DEPOSITION | MICROCOATING TECHNOLOGIES, INC. | 2002-08-13 | — | — | US | disclosed |
| US-6270835-B1 | PROVIDING THREE-LAYER STRUCTURE COMPRISING DIELECTRIC LAYER AND ELECTRICALLY CONDUCTIVE LAYERS; PATTERNING ELECTRICALLY CONDUCTIVE LAYER TO FORM STRUCTURE; EMBEDDING INTO SECOND DIELECTRIC MATERIAL; PATTERNING ELECTRICALLY CONDUCTIVE LAYER | MICROCOATING TECHNOLOGIES, INC. | 2001-08-07 | — | — | US | disclosed |
| US-6207522-B1 | Formation of thin film capacitors | MICROCOATING TECHNOLOGIES | 2001-03-27 | — | — | US | disclosed |
| EP-1005260-A2 | Formation of thin film capacitors | MicroCoating Technologies, Inc. (US) | 2000-05-31 | — | — | EP | disclosed |