Known targets — ChEMBL curated mechanism
The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL865017 | 0.87 | — | — | |
| SCHEMBL3202966 | 0.87 | — | — | |
| SCHEMBL2899542 | 0.87 | — | — | |
| SCHEMBL6699419 | 0.75 | — | — | |
| SCHEMBL3148579 | 0.75 | — | — | |
| SCHEMBL5615326 | 0.75 | — | — | |
| SCHEMBL1981980 | 0.75 | — | — | |
| SCHEMBL58411 | 0.75 | — | — | |
| SCHEMBL6855995 | 0.75 | — | — | |
| SCHEMBL73924 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20080207426-A1 | Heat Insulating Composite and Methods of Manufacturing Thereof | ADVANCED GLASS CERAMICS ESTABLISHMENT (LI) | 2008-08-28 | — | — | US | claimed |
| WO-2008043373-A1 | HEAT INSULATING COMPOSITE AND METHODS OF MANUFACTURING THEREOF | ADVANCED GLASS CERAMICS ESTABLISHMENT (LI) | 2008-04-17 | — | — | WO | claimed |
| EP-1890981-A1 | HEAT INSULATING COMPOSITE AND METHODS OF MANUFACTURING THEREOF | Advanced Glass Ceramics Establishment (LI) | 2008-02-27 | — | — | EP | claimed |
| WO-2006128672-A1 | HEAT INSULATING COMPOSITE AND METHODS OF MANUFACTURING THEREOF | ADVANCED GLASS CERAMICS ESTABLISHMENT (LI) | 2006-12-07 | — | — | WO | claimed |
| US-20040196620-A1 | Dielectric laminate for a capacitor | SHIPLEY COMPANY, L.L.C. | 2004-10-07 | — | — | US | claimed |
| US-20020176989-A1 | Dielectric laminate for a capacitor | SHIPLEY COMPANY, L.L.C. | 2002-11-28 | — | — | US | claimed |
| CN-120229763-A | High-performance long-cycle high-nickel ternary positive electrode material and preparation method thereof | 安徽得壹能源科技有限公司 | 2025-07-01 | — | — | CN | disclosed |
| US-8278243-B2 | Laser imaging | DATALASE LTD. (GB) | 2012-10-02 | — | — | US | disclosed |
| US-20100075848-A1 | Laser Imaging | DATALASE LTD. (GB) | 2010-03-25 | — | — | US | disclosed |
| US-20080207426-A1 | Heat Insulating Composite and Methods of Manufacturing Thereof | ADVANCED GLASS CERAMICS ESTABLISHMENT (LI) | 2008-08-28 | — | — | US | disclosed |
| WO-2008043373-A1 | HEAT INSULATING COMPOSITE AND METHODS OF MANUFACTURING THEREOF | ADVANCED GLASS CERAMICS ESTABLISHMENT (LI) | 2008-04-17 | — | — | WO | disclosed |
| EP-1890981-A1 | HEAT INSULATING COMPOSITE AND METHODS OF MANUFACTURING THEREOF | Advanced Glass Ceramics Establishment (LI) | 2008-02-27 | — | — | EP | disclosed |
| WO-2006128672-A1 | HEAT INSULATING COMPOSITE AND METHODS OF MANUFACTURING THEREOF | ADVANCED GLASS CERAMICS ESTABLISHMENT (LI) | 2006-12-07 | — | — | WO | disclosed |
| EP-1704057-A1 | LASER IMAGING | Sherwood Technology LTD. (GB) | 2006-09-27 | — | — | EP | disclosed |
| WO-2005068207-A1 | LASER IMAGING | DATALASE LTD. (GB) | 2005-07-28 | — | — | WO | disclosed |
| US-20040196620-A1 | Dielectric laminate for a capacitor | SHIPLEY COMPANY, L.L.C. | 2004-10-07 | — | — | US | disclosed |
| US-20020176989-A1 | Dielectric laminate for a capacitor | SHIPLEY COMPANY, L.L.C. | 2002-11-28 | — | — | US | disclosed |
| EP-1251530-A2 | Dielectric laminate for a capacitor | Shipley Company LLC (US) | 2002-10-23 | — | — | EP | disclosed |