SCHEMBL321444

SCHEMBL321444

c1ccc2c(CCc3c4ccccc4nc4ccccc34)c3ccccc3nc2c1

nearest known ligand 0.75

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.75
ALDH1A1 P00352 5/20 0.75
HPGD P15428 3/20 0.75
GAA P10253 3/20 0.75
GLA P06280 5/20 0.54
MAOA P21397 2/20 0.54
CASP1 P29466 2/20 0.54
CASP7 P55210 2/20 0.54
SMN1; SMN2 Q16637 2/20 0.54
HSD17B10 Q99714 2/20 0.54
CHRM2 P08172 1/20 0.54
ADRA2A P08913 1/20 0.54
ADORA3 P0DMS8 1/20 0.54
CHRM1 P11229 1/20 0.54
NQO2 P16083 1/20 0.54
DRD1 P21728 1/20 0.54
ACHE P22303 1/20 0.54
SLC6A2 P23975 1/20 0.54
ADRA1A P35348 1/20 0.54
OPRM1 P35372 1/20 0.54

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29446776 1.00 KDM4E (0.75) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL29446754 0.90 KDM4E (0.69) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL29385771 0.90 KDM4E (0.69) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL320907 0.90 KDM4E (0.69) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL321679 0.90 KDM4E (0.69) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL601351 0.88 KDM4E (0.67) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL599897 0.88 KDM4E (0.67) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL600275 0.88 KDM4E (0.67) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL194341 0.88 KDM4E (0.67) KDM4EALDH1A1HPGDGAAGLA
SCHEMBL320922 0.88 KDM4E (0.67) KDM4EALDH1A1HPGDGAAGLA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 54 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6156870-A Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-12-05 US claimed
JP-11209612-A None JP disclosed
WO-2026105768-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN 株式会社レゾナック 2026-05-21 WO disclosed
US-12560867-B2 Photosensitive element and method for producing photosensitive element RESONAC CORPORATION (JP) 2026-02-24 US disclosed
US-20250278024-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2025-09-04 US disclosed
US-20240392048-A1 POLYMER, PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR FORMING WIRING PATTERN RESONAC CORP (JP) 2024-11-28 US disclosed
WO-2024176305-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-08-29 WO disclosed
WO-2024176541-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-08-29 WO disclosed
WO-2024135501-A1 PHOTOSENSITIVE ELEMENT AND METHOD FOR FORMING RESIST PATTERN 株式会社レゾナック 2024-06-27 WO disclosed
WO-2024116513-A1 PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD 株式会社レゾナック 2024-06-06 WO disclosed
US-20090231521-A1 METHOD FOR PRODUCING PARTITION WALL FOR COLOR FILTER, SUBSTRATE WITH PARTITION WALL FOR COLOR FILTER, COLOR FILTER FOR DISPLAY ELEMENT, AND DISPLAY DEVICE FUJIFILM CORPORATION (JP) 2009-09-17 US disclosed
US-20090176914-A1 Ink, Color Filter, and Method for Manufacturing the same, and Display Device FUJIFILM CORPORATION (JP) 2009-07-09 US disclosed
US-7517636-B2 Can shorten developing time and has high stripping property and tent reliability HITACHI CHEMICAL CO., LTD. (JP) 2009-04-14 US disclosed
US-20090040433-A1 LIQUID CRYSTAL DISPLAY DEVICE AND COLOR FILM PLATE, AND PROCESSES FOR PRODUCING THE SAME FUJIFILM CORPORATION (JP) 2009-02-12 US disclosed
US-20080292993-A1 PHOTO-CATIONIC POLYMERIZABLE EPOXY RESIN COMPOSITION, LIQUID DISCHARGE HEAD, AND MANUFACTURING METHOD THEREOF CANON KABUSHIKI KAISHA (JP) 2008-11-27 US disclosed
JP-2004341354-A PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT USING THE SAME, METHOD FOR FORMING RESIST PATTERN, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD HITACHI CHEM CO LTD 2004-12-02 JP disclosed
US-20030186166-A1 Photosensitive resin composition, photosensitive element, production method of resist pattern and production method for printed circuit board HITACHI CHEMICAL CO., LTD. (JP) 2003-10-02 US disclosed
US-6156870-A Resin composition which can be cured by application of heat or irradiation of light, film, laminate and production of multilayer wiring board HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-12-05 US disclosed
JP-H11209612-A PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITION AND PRODUCTION OF PATTERN BY USING SAME HITACHI CHEM CO LTD 1999-08-03 JP disclosed
EP-0503076-A1 PHOTOPOLYMERIZABLE COMPOSITION AND PHOTOPOLYMERIZABLE ELEMENT HITACHI CHEMICAL CO., LTD. (JP) 1992-09-16 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12560867-B2 Photosensitive element and method for producing photosensitive element TERB1, PRDM9, PRPF8 KDM4E 575/4885ALDH1A1 3248/4885HPGD 4694/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.