SCHEMBL3227086

SCHEMBL3227086

CCCCCCCCCCCCC(C)C(=O)C(C)CCCCCCCCCCCC

nearest known ligand 0.71

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.71
ACE2 Q9BYF1 1/20 0.57
CA2 P00918 1/20 0.54
GPR84 Q9NQS5 7/20 0.52
FDPS P14324 3/20 0.52
FFAR1 O14842 2/20 0.52
FFAR4 Q5NUL3 1/20 0.52
MAPT P10636 1/20 0.50
LCK P06239 1/20 0.50
PPARD Q03181 1/20 0.50
ZDHHC20 Q5W0Z9 1/20 0.50
ZDHHC2 Q9UIJ5 1/20 0.50

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3222574 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL3222542 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL4350645 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL2710871 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL1922411 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL1321582 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL3218364 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL3211014 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL3231557 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS
SCHEMBL28042655 1.00 CA1 (0.71) CA1ACE2CA2GPR84FDPS

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105208858-A Compounds, compositions, and methods for repelling an insect from an area, article, and/or structure BAYER CROPSCIENCE LP 2015-12-30 CN claimed
CN-109608785-B Anti-aging PVC composition and preparation method and application thereof 万华化学集团股份有限公司 2020-07-28 CN disclosed
EP-2669318-B1 MANUFACTURING METHOD FOR POLYACRYLIC ACID (SALT) -BASED WATER-ABSORBENT RESIN POWDER NIPPON CATALYTIC CHEM IND (JP) 2020-06-17 EP disclosed
CN-110446770-A Reversible thermal discoloration composition and reversible thermal discoloration microcapsule pigment containing the same PILOT INK CO LTD 2019-11-12 CN disclosed
CN-106459637-B Reversible thermochromic seal ink composition and seal 株式会社百乐 2019-10-01 CN disclosed
CN-105754099-B Composition and polymer 旭化成株式会社 2018-09-18 CN disclosed
CN-107108417-A For making phenols substrate method for hydroxylation 罗地亚经营管理公司 2017-08-29 CN disclosed
CN-103980103-B PHENOLIC COMPOUND, EPOXY RESIN, EPOXY RESIN COMPOSITION, PREPREG, AND CURED PRODUCT THEREOF 日本化药株式会社 2017-04-12 CN disclosed
CN-106459637-A Ink composition for reversibly thermochromic stamps and stamp 株式会社百乐 2017-02-22 CN disclosed
US-9567414-B2 Method for producing polyacrylic acid (salt)-based water absorbent resin powder NIPPON SHOKUBAI CO., LTD. (JP) 2017-02-14 US disclosed
CN-1310598-C Flavored oil-in-water emulsions for food use FIRMENICH & CIE (CH) 2007-04-18 CN disclosed
US-20060275702-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2006-12-07 US disclosed
CN-1276066-C Rose oil and its producing process WANG JINMING (CN) 2006-09-20 CN disclosed
US-20060057495-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI 2006-03-16 US disclosed
CN-1655691-A Flavoured oil-in-water emulsions for food applications FIRMENICH & CIE (CH) 2005-08-17 CN disclosed
CN-1648223-A Rose oil and its producing process WANG JINMING (CN) 2005-08-03 CN disclosed
CN-1203039-C Method for producing dihydric phenol UBE INDUSTRIES (JP) 2005-05-25 CN disclosed
CN-1572368-A Novel proton type beta zeolite, preparation method thereof and process for preparing phenol compound using the same UBE INDUSTRIES (JP) 2005-02-02 CN disclosed
CN-1330061-A Method for producing dihydric phenol UBE INDUSTRIES (JP) 2002-01-09 CN disclosed
US-20010019811-A1 Negative-working photosensitive resin composition and photosensitive resin plate using the same TAKANASHI HIROSHI (JP) 2001-09-06 US disclosed