⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL8973287 | 0.63 | — | — | |
| SCHEMBL13461879 | 0.60 | — | — | |
| SCHEMBL15468280 | 0.60 | — | — | |
| SCHEMBL28852321 | 0.60 | — | — | |
| SCHEMBL12847209 | 0.60 | — | — | |
| SCHEMBL10177686 | 0.60 | — | — | |
| SCHEMBL26292 | 0.60 | — | — | |
| SCHEMBL8466052 | 0.57 | — | — | |
| SCHEMBL8467152 | 0.57 | — | — | |
| SCHEMBL28952826 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 71 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240218503-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2024-07-04 | — | — | US | claimed |
| US-11959167-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2024-04-16 | — | — | US | claimed |
| US-20220298625-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2022-09-22 | — | — | US | claimed |
| US-11384429-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2022-07-12 | — | — | US | claimed |
| WO-2021041593-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. (US) | 2021-03-04 | — | — | WO | claimed |
| US-20210062330-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2021-03-04 | — | — | US | claimed |
| US-20170321320-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2017-11-09 | — | — | US | claimed |
| US-20150325446-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2015-11-12 | — | — | US | claimed |
| WO-2009134840-A2 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. (US) | 2009-11-05 | — | — | WO | claimed |
| WO-2009134925-A2 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS | APPLIED MATERIALS, INC. (US) | 2009-11-05 | — | — | WO | claimed |
| US-20090269507-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2009-10-29 | — | — | US | claimed |
| US-20080268635-A1 | PROCESS FOR FORMING COBALT AND COBALT SILICIDE MATERIALS IN COPPER CONTACT APPLICATIONS | APPLIED MATERIALS, INC. | 2008-10-30 | — | — | US | claimed |
| WO-2007121249-A2 | PROCESS FOR FORMING COBALT-CONTAINING MATERIALS | APPLIED MATERIALS, INC. (US) | 2007-10-25 | — | — | WO | claimed |
| US-20070202254-A1 | PROCESS FOR FORMING COBALT-CONTAINING MATERIALS | APPLIED MATERIALS, INC. | 2007-08-30 | — | — | US | claimed |
| US-12564025-B2 | Interconnect with redeposited metal capping and method forming same | TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. (TW) | 2026-02-24 | — | — | US | disclosed |
| US-20240218503-A1 | SELECTIVE COBALT DEPOSITION ON COPPER SURFACES | APPLIED MATERIALS, INC. | 2024-07-04 | — | — | US | disclosed |
| US-11959167-B2 | Selective cobalt deposition on copper surfaces | APPLIED MATERIALS, INC. (US) | 2024-04-16 | — | — | US | disclosed |
| US-20070202254-A1 | PROCESS FOR FORMING COBALT-CONTAINING MATERIALS | APPLIED MATERIALS, INC. | 2007-08-30 | — | — | US | disclosed |
| US-20060240187-A1 | Deposition of an intermediate catalytic layer on a barrier layer for copper metallization | APPLIED MATERIALS, INC. | 2006-10-26 | — | — | US | disclosed |
| US-20060153973-A1 | Ruthenium layer formation for copper film deposition | APPLIED MATERIALS, INC. | 2006-07-13 | — | — | US | disclosed |