SCHEMBL3241100

SCHEMBL3241100

CCC(CC)C(=O)C(CC)(CC)C(=O)[O-].CCC(CC)C(=O)C(CC)(CC)C(=O)[O-].CCC(CC)C(=O)C(CC)(CC)C(=O)[O-].CCC(CC)C(=O)C(CC)(CC)C(=O)[O-].[Ti+4]

nearest known ligand 0.36

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
CA2 P00918 2/20 0.36
TSHR P16473 3/20 0.33
CYP3A4 P08684 2/20 0.33
NFKB1 P19838 2/20 0.33
NPSR1 Q6W5P4 2/20 0.33
USP2 O75604 1/20 0.32
MAPK1 P28482 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL159864 0.96 CA2 (0.36) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL5974362 0.87 CA2 (0.32) CA2
SCHEMBL9062669 0.84 CA4 (0.33) CA2
SCHEMBL11427373 0.80 CA2 (0.48) CA2TSHRCYP3A4NFKB1NPSR1
SCHEMBL17433623 0.78 FFAR3 (0.36) TSHRCYP3A4NFKB1NPSR1
SCHEMBL28048919 0.78 FFAR3 (0.36) TSHRCYP3A4NFKB1NPSR1
SCHEMBL993238 0.77 CA2 (0.37) CA2TSHRUSP2MAPK1
SCHEMBL620951 0.77
SCHEMBL27563771 0.74 USP2 (0.32) CA2TSHRUSP2MAPK1
SCHEMBL15333904 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 22 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112030253-A Dyeable polypropylene modified fiber for satin 江苏瑞康安全装备有限公司 2020-12-04 CN claimed
CN-112030253-A Dyeable polypropylene modified fiber for satin 江苏瑞康安全装备有限公司 2020-12-04 CN disclosed
CN-107614784-B Sizing agent for reinforcing fiber and use thereof 松本油脂制药株式会社 2020-03-17 CN disclosed
US-10421864-B2 Metal surface processing agent NOK CORPORATION (JP) 2019-09-24 US disclosed
US-10421865-B2 Rubber-metal adhesive NOK CORPORATION (JP) 2019-09-24 US disclosed
EP-2930257-B1 METAL SURFACE PROCESSING AGENT NOK CORP (JP) 2017-09-27 EP disclosed
US-20170037254-A1 RUBBER-METAL ADHESIVE NOK CORPORATION (JP) 2017-02-09 US disclosed
US-9529116-B2 Photosensitive resin composition and application of the same CHI MEI CORPORATION (TW) 2016-12-27 US disclosed
US-9223206-B2 Photosensitive resin composition and applications of the same CHI MEI CORPORATION (TW) 2015-12-29 US disclosed
EP-2930257-A1 METAL SURFACE PROCESSING AGENT NOK Corporation (JP) 2015-10-14 EP disclosed
US-20140124716-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME CHI MEI CORPORATION (TW) 2014-05-08 US disclosed
CN-103376648-A Photosensitive resin composition, black matrix, color filter and liquid crystal display element CHI MEI CORP 2013-10-30 CN disclosed
US-20130277627-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATIONS OF THE SAME CHI MEI CORPORATION (TW) 2013-10-24 US disclosed
EP-2204472-A2 Methods for forming wiring and electrode JSR Corporation (JP) 2010-07-07 EP disclosed
EP-1462544-B1 Methods for forming wiring and electrode JSR CORP (JP) 2010-05-19 EP disclosed
US-7429778-B2 Methods for forming wiring and electrode JSR CORPORATION (JP) 2008-09-30 US disclosed
US-7071084-B2 Methods for forming wiring and electrode JSR CORPORATION (JP) 2006-07-04 US disclosed
US-20060024937-A1 Methods for forming wiring and electrode JSR CORPORATION (JP) 2006-02-02 US disclosed
US-20040192038-A1 Methods for forming wiring and electrode JSR CORPORATION (JP) 2004-09-30 US disclosed
EP-1462544-A2 Methods for forming wiring and electrode JSR Corporation (JP) 2004-09-29 EP disclosed