⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9302609 | 0.86 | — | — | |
| SCHEMBL18745656 | 0.79 | — | — | |
| SCHEMBL258090 | 0.78 | — | — | |
| SCHEMBL1275422 | 0.78 | LMNA (0.35) | — | |
| SCHEMBL17581543 | 0.78 | — | — | |
| SCHEMBL134615 | 0.76 | TSHR (0.36) | — | |
| SCHEMBL8508825 | 0.76 | — | — | |
| SCHEMBL9244958 | 0.75 | — | — | |
| SCHEMBL8680521 | 0.75 | LMNA (0.43) | — | |
| SCHEMBL9016288 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-111937121-B | Cleavable additives for use in methods of making semiconductor substrates | 巴斯夫欧洲公司 | 2023-12-08 | — | — | CN | claimed |
| EP-3776635-B1 | CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE | BASF SE (DE) | 2022-12-07 | — | — | EP | claimed |
| EP-3776635-A1 | CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE | BASF SE (DE) | 2021-02-17 | — | — | EP | claimed |
| CN-111937121-A | Cleavable additives for use in a method of manufacturing a semiconductor substrate | 巴斯夫欧洲公司 | 2020-11-13 | — | — | CN | claimed |
| CN-111937121-B | Cleavable additives for use in methods of making semiconductor substrates | 巴斯夫欧洲公司 | 2023-12-08 | — | — | CN | disclosed |
| US-11742197-B2 | Cleavable additives for use in a method of making a semiconductor substrate | BASF SE (DE) | 2023-08-29 | — | — | US | disclosed |
| EP-3776635-B1 | CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE | BASF SE (DE) | 2022-12-07 | — | — | EP | disclosed |
| US-20210166934-A1 | CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE | BASF SE (DE) | 2021-06-03 | — | — | US | disclosed |
| EP-3776635-A1 | CLEAVABLE ADDITIVES FOR USE IN A METHOD OF MAKING A SEMICONDUCTOR SUBSTRATE | BASF SE (DE) | 2021-02-17 | — | — | EP | disclosed |
| CN-111937121-A | Cleavable additives for use in a method of manufacturing a semiconductor substrate | 巴斯夫欧洲公司 | 2020-11-13 | — | — | CN | disclosed |
| CN-101410434-B | Electronic devices containing acene-thiophene copolymers | 3M INNOVATIVE PROPERTIES CO. (US) | 2011-12-21 | — | — | CN | disclosed |
| CN-101415745-B | Acene-thiophene copolymers | 3M INNOVATIVE PROPERTIES CO | 2011-06-15 | — | — | CN | disclosed |
| WO-2007117872-A2 | ELECTRONIC DEVICES CONTAINING ACENE-THIOPHENE COPOLYMERS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2007-10-18 | — | — | WO | disclosed |
| WO-2007115021-A2 | ACENE-THIOPHENE COPOLYMERS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2007-10-11 | — | — | WO | disclosed |
| US-20070228360-A1 | ELECTRONIC DEVICES CONTAINING ACENE-THIOPHENE COPOLYMERS | 3M INNOVATIVE PROPERTIES COMPANY | 2007-10-04 | — | — | US | disclosed |
| US-20070232781-A1 | ACENE-THIOPHENE COPOLYMERS | 3M INNOVATIVE PROPERTIES COMPANY | 2007-10-04 | — | — | US | disclosed |
| US-5281625-A | Benzyl substituted guanidine derivatives, salts, and metal complexes | BASF AKTIENGESELLSCHAFT (DE) | 1994-01-25 | — | — | US | disclosed |
| EP-0534501-A2 | Fungicidal guanidines | BASF Aktiengesellschaft (DE) | 1993-03-31 | — | — | EP | disclosed |
| US-5126374-A | For plants, seeds, soils, effective at low concentrations | BASF AKTIENGESELLSCHAFT (DE) | 1992-06-30 | — | — | US | disclosed |
| EP-0406699-A2 | Fungicidal guanidines | BASF Aktiengesellschaft (DE) | 1991-01-09 | — | — | EP | disclosed |