Known targets — ChEMBL curated mechanism
ADRA2AADRA2BADRA2CADRB2AGTR1AVPR1AAVPR1BAVPR2BDKRB2CALCRCHRNA3CHRNB4ESR1ESR2GHSRGNRHRGSC1HSPA8MALT1MC1RMC4RNOS1NOS2NOS3OPRK1OXTRRAMP1RAMP2RAMP3SCN5ASSTR1SSTR2SSTR3SSTR4SSTR5dacAdacBdacCfolPftsImrcAmrcBmrdArplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO
The experimentally established mechanism targets of Acetic Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.59 |
| ▸ | USP2 | O75604 | 2/20 | 0.47 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.47 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.47 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.47 |
| ▸ | MAPT | P10636 | 1/20 | 0.46 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.46 |
| ▸ | PLA2G2C | Q5R387 | 5/20 | 0.44 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.43 |
| ▸ | HTT | P42858 | 1/20 | 0.43 |
| ▸ | CES2 | O00748 | 1/20 | 0.42 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.41 |
| ▸ | LPAR5 | Q9H1C0 | 1/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Acetic Acid SCHEMBL28281188 | 0.94 | HSD17B10 (0.57) | HSD17B10USP2MAPTTDP1PLA2G2C | |
| Acetic Acid SCHEMBL27583636 | 0.92 | HSD17B10 (0.55) | HSD17B10USP2MAPTPLA2G2CSPHK1 | |
| Propionic Acid SCHEMBL3284799 | 0.90 | HSD17B10 (0.57) | HSD17B10USP2ALDH1A1KDM4EALOX15 | |
| SCHEMBL15902 | 0.89 | — | — | |
| SCHEMBL15902723 | 0.89 | HSD17B10 (0.73) | HSD17B10USP2ALDH1A1KDM4EALOX15 | |
| SCHEMBL17551898 | 0.89 | — | — | |
| SCHEMBL9319125 | 0.89 | — | — | |
| Urea SCHEMBL28944942 | 0.88 | HSD17B10 (0.59) | HSD17B10USP2ALDH1A1KDM4EALOX15 | |
| Acetic Acid SCHEMBL3099063 | 0.88 | HSD17B10 (0.78) | HSD17B10USP2ALDH1A1KDM4EALOX15 | |
| Hydrogen Sulfide SCHEMBL5381665 | 0.87 | HSD17B10 (0.70) | HSD17B10USP2ALDH1A1KDM4EALOX15 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2020138189-A1 | FILM FORMING COMPOSITION | 日産化学株式会社 | 2020-07-02 | — | — | WO | disclosed |
| WO-2020085508-A1 | FILM-FORMING COMPOSITION | 日産化学株式会社 | 2020-04-30 | — | — | WO | disclosed |
| CN-105474097-B | Photosensitive resin composition, photosensitive element, semiconductor device, and method for forming resist pattern | 日立化成株式会社 | 2019-09-17 | — | — | CN | disclosed |
| CN-103733135-B | Resist composition, method for forming resist pattern, polyphenol compound used for the same, and alcohol compound derived from the polyphenol compound | 三菱瓦斯化学株式会社 | 2018-11-27 | — | — | CN | disclosed |
| CN-108350146-A | The composition epoxy resin of alkyl is stretched containing long-chain | 日产化学工业株式会社 | 2018-07-31 | — | — | CN | disclosed |
| CN-108349919-A | Multi-functional epoxy compound and curable adhensive compositions containing it | 日产化学工业株式会社 | 2018-07-31 | — | — | CN | disclosed |
| CN-108350252-A | Epoxy reactive diluent and composition epoxy resin containing it | 日产化学工业株式会社 | 2018-07-31 | — | — | CN | disclosed |
| CN-105086605-B | A kind of photocuring heat-curing composition ink, purposes and the wiring board containing it | 深圳市容大感光科技股份有限公司 | 2018-07-27 | — | — | CN | disclosed |
| CN-108292096-A | PHOTOSENSITIVE RESIN COMPOSITION AND ORGANIC INSULATING FILM PREPARED THEREFROM | 罗门哈斯电子材料韩国有限公司 | 2018-07-17 | — | — | CN | disclosed |
| CN-107849332-A | Conductive composition, conductor and flexible printed circuit board | 太阳油墨制造株式会社 | 2018-03-27 | — | — | CN | disclosed |
| EP-1490501-A2 | ENZYMATIC RESOLUTION OF PROPYLENE GLYCOL ALKYL (OR ARYL) ETHERS AND ETHER ACETATES | Dow Global Technologies Inc. (US) | 2004-12-29 | — | — | EP | disclosed |
| US-6824833-B2 | STACKED DIELECTRIC | JSR CORPORATION (JP) | 2004-11-30 | — | — | US | disclosed |
| CN-1545641-A | Negative type colored photosensitive composition | 日本化药株式会社 | 2004-11-10 | — | — | CN | disclosed |
| US-6749944-B2 | VAPOR DEPOSITION, OSCILLATION, HEATING USING ORGANOSILICON COMPOUND; FORMING DIELECTRIC | JSR CORPORATION (JP) | 2004-06-15 | — | — | US | disclosed |
| WO-2003083126-A2 | ENZYMATIC RESOLUTION OF PROPYLENE GLYCOL ALKYL (OR ARYL) ETHERS AND ETHER ACETATES | DOW GLOBAL TECHNOLOGIES INC. (US) | 2003-10-09 | — | — | WO | disclosed |
| US-20030077461-A1 | Stacked film, insulating film and substrate for semiconductor | JSR CORPORATION (JP) | 2003-04-24 | — | — | US | disclosed |
| EP-1298176-A2 | Stacked film insulating film and substrate for semiconductor | JSR Corporation (JP) | 2003-04-02 | — | — | EP | disclosed |
| US-20030059628-A1 | Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor | JSR CORPORATION (JP) | 2003-03-27 | — | — | US | disclosed |
| EP-1295924-A2 | Stacked film, method for the formation of stacked film, insulating film, and substrate for semiconductor | JSR Corporation (JP) | 2003-03-26 | — | — | EP | disclosed |
| US-5578377-A | ANTIREFLECTIVE FILM | ASAHI GLASS COMPANY LTD. (JP) | 1996-11-26 | — | — | US | disclosed |