⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphine SCHEMBL27626535 | 0.87 | — | — | |
| Phosphine SCHEMBL15475257 | 0.87 | — | — | |
| Phosphine SCHEMBL3266420 | 0.87 | — | — | |
| Phosphine SCHEMBL28466358 | 0.87 | — | — | |
| Phosphine SCHEMBL722469 | 0.87 | — | — | |
| Phosphine SCHEMBL25272527 | 0.82 | — | — | |
| SCHEMBL2143586 | 0.82 | — | — | |
| Phosphine SCHEMBL18919825 | 0.82 | — | — | |
| Phosphine SCHEMBL862073 | 0.82 | — | — | |
| Phosphine SCHEMBL16632770 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103074649-B | Strengthen mine individual hydraulic prop cylinder tube preserving method | SICHUAN HEAVY TRUCK WANGPAI XINGCHENG HYDRAULIC PART CO., LTD. (CN) | 2015-10-07 | — | — | CN | claimed |
| US-10396045-B2 | Metal on both sides of the transistor integrated with magnetic inductors | INTEL CORPORATION (US) | 2019-08-27 | — | — | US | disclosed |
| US-20190006296-A1 | METAL ON BOTH SIDES OF THE TRANSISTOR INTEGRATED WITH MAGNETIC INDUCTORS | INTEL CORP (US) | 2019-01-03 | — | — | US | disclosed |
| CN-103074649-B | Strengthen mine individual hydraulic prop cylinder tube preserving method | SICHUAN HEAVY TRUCK WANGPAI XINGCHENG HYDRAULIC PART CO., LTD. (CN) | 2015-10-07 | — | — | CN | disclosed |
| CN-103074649-B | Strengthen mine individual hydraulic prop cylinder tube preserving method | SICHUAN HEAVY TRUCK WANGPAI XINGCHENG HYDRAULIC PART CO., LTD. (CN) | 2015-10-07 | — | — | CN | disclosed |
| US-20100022083-A1 | CARBON NANOTUBE INTERCONNECT STRUCTURES | INTEL CORPORATION (US) | 2010-01-28 | — | — | US | disclosed |
| US-7625817-B2 | Method of fabricating a carbon nanotube interconnect structures | INTEL CORPORATION (US) | 2009-12-01 | — | — | US | disclosed |
| CN-100397612-C | Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs | INTEL CORP (US) | 2008-06-25 | — | — | CN | disclosed |
| US-20070155158-A1 | Carbon nanotube interconnect structures | INTEL CORPORATION | 2007-07-05 | — | — | US | disclosed |
| CN-1322572-C | Interconnect structures and a method of electroless introduction of interconnect structures | INTEL CORP (US) | 2007-06-20 | — | — | CN | disclosed |
| US-7105363-B2 | Cladded conductor for use in a magnetoelectronics device and method for fabricating the same | FREESCALE SEMICONDUCTOR, INC. (US) | 2006-09-12 | — | — | US | disclosed |
| US-20050158992-A1 | Cladded conductor for use in a magnetoelectronics device and method for fabricating the same | FREESCALE SEMICONDUCTOR, INC. | 2005-07-21 | — | — | US | disclosed |
| CN-1623228-A | Use of conductive electrolessly deposited etch stop layers, liner layers and via plugs in interconnect structures | INTEL CORP (US) | 2005-06-01 | — | — | CN | disclosed |
| US-6885074-B2 | Cladded conductor for use in a magnetoelectronics device and method for fabricating the same | FREESCALE SEMICONDUCTOR, INC. (US) | 2005-04-26 | — | — | US | disclosed |
| US-6867473-B2 | Plating a conductive material on a dielectric material | INTEL CORPORATION (US) | 2005-03-15 | — | — | US | disclosed |
| WO-2004051742-A1 | MAGNETOELECTRONICS DEVICE AND METHOD FOR FABRICATING THE SAME | FREESCALE SEMICONDUCTOR, INC. (US) | 2004-06-17 | — | — | WO | disclosed |
| US-20040104483-A1 | Plating a conductive material on a dielectric material | GOODNER MICHAEL D (US) | 2004-06-03 | — | — | US | disclosed |
| US-20040099908-A1 | Cladded conductor for use in a magnetoelectronics device and method for fabricating the same | FREESCALE SEMICONDUCTOR, INC. | 2004-05-27 | — | — | US | disclosed |
| CN-1484856-A | Interconnect structure and method for electroless introduction of interconnect structure | ض� | 2004-03-24 | — | — | CN | disclosed |
| US-6682989-B1 | Plating a conductive material on a dielectric material | INTEL CORPORATION | 2004-01-27 | — | — | US | disclosed |