Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.35 |
| ▸ | EP300 | Q09472 | 1/20 | 0.31 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.31 |
| ▸ | CREBBP | Q92793 | 1/20 | 0.31 |
| ▸ | ELANE | P08246 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL448851 | 0.93 | ALDH1A1 (0.35) | ALDH1A1EP300HIF1ACREBBPELANE | |
| SCHEMBL23494215 | 0.89 | EP300 (0.38) | ALDH1A1EP300HIF1ACREBBP | |
| SCHEMBL3285655 | 0.89 | ALDH1A1 (0.38) | ALDH1A1ELANE | |
| Methacrylic Acid SCHEMBL4802536 | 0.88 | ALDH1A1 (0.32) | ALDH1A1EP300HIF1ACREBBPELANE | |
| SCHEMBL23494175 | 0.86 | EP300 (0.36) | ALDH1A1EP300HIF1ACREBBP | |
| SCHEMBL29733355 | 0.86 | EP300 (0.33) | ALDH1A1EP300HIF1ACREBBP | |
| SCHEMBL3281463 | 0.84 | ALDH1A1 (0.41) | ALDH1A1ELANE | |
| SCHEMBL29733443 | 0.84 | EP300 (0.32) | EP300HIF1ACREBBP | |
| SCHEMBL890703 | 0.84 | EP300 (0.32) | EP300HIF1ACREBBP | |
| SCHEMBL31115201 | 0.82 | EP300 (0.35) | ALDH1A1EP300HIF1ACREBBP |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7700269-B2 | Method of forming stack layer and method of manufacturing electronic device having the same | SAMSUNG SDI CO., LTD. (KR) | 2010-04-20 | — | — | US | claimed |
| US-7374859-B2 | Protective layers compatible with thick film pastes | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2008-05-20 | — | — | US | claimed |
| US-7354781-B2 | Method of manufacturing field emission device | SAMSUNG SDI CO., LTD. (KR) | 2008-04-08 | — | — | US | claimed |
| US-20060275966-A1 | Method of manufacturing field emission device | SAMSUNG SDI CO., LTD. (KR) | 2006-12-07 | — | — | US | claimed |
| US-20060275987-A1 | Method of forming stack layer and method of manufacturing electronic device having the same | SAMSUNG SDI CO., LTD., A CORP. OF THE REPUBLIC OF KOREA (KR) | 2006-12-07 | — | — | US | claimed |
| US-20060025549-A1 | Process for using protective layers in the fabrication of electronic devices | E. I. DU PONT DE NEMOURS AND COMPANY | 2006-02-02 | — | — | US | claimed |
| US-20050227168-A1 | UV radiation blocking protective layers compatible with thick film pastes | E. I. DU PONT DE NEMOURS AND COMPANY | 2005-10-13 | — | — | US | claimed |
| US-20040170925-A1 | Positive imageable thick film compositions | E.I. DU PONT DE NEMOURS AND COMPANY | 2004-09-02 | — | — | US | claimed |
| US-20040137364-A1 | Protective layers compatible with thick film pastes | E. I. DU PONT DE NEMOURS AND COMPANY | 2004-07-15 | — | — | US | claimed |
| US-7700269-B2 | Method of forming stack layer and method of manufacturing electronic device having the same | SAMSUNG SDI CO., LTD. (KR) | 2010-04-20 | — | — | US | disclosed |
| US-7608383-B2 | UV radiation blocking protective layers compatible with thick film pastes | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2009-10-27 | — | — | US | disclosed |
| US-20080274430-A1 | UV RADIATION BLOCKING PROTECTIVE LAYERS COMPATIBLE WITH THICK FILM PASTES | KIM YOUNG H | 2008-11-06 | — | — | US | disclosed |
| US-7402373-B2 | UV radiation blocking protective layers compatible with thick film pastes | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2008-07-22 | — | — | US | disclosed |
| US-20080166666-A1 | POSITIVE IMAGEABLE THICK FILM COMPOSITION | ROACH DAVID HERBERT | 2008-07-10 | — | — | US | disclosed |
| US-7354781-B2 | Method of manufacturing field emission device | SAMSUNG SDI CO., LTD. (KR) | 2008-04-08 | — | — | US | disclosed |
| US-20060275966-A1 | Method of manufacturing field emission device | SAMSUNG SDI CO., LTD. (KR) | 2006-12-07 | — | — | US | disclosed |
| US-20060275987-A1 | Method of forming stack layer and method of manufacturing electronic device having the same | SAMSUNG SDI CO., LTD., A CORP. OF THE REPUBLIC OF KOREA (KR) | 2006-12-07 | — | — | US | disclosed |
| US-20060025549-A1 | Process for using protective layers in the fabrication of electronic devices | E. I. DU PONT DE NEMOURS AND COMPANY | 2006-02-02 | — | — | US | disclosed |
| US-20050227168-A1 | UV radiation blocking protective layers compatible with thick film pastes | E. I. DU PONT DE NEMOURS AND COMPANY | 2005-10-13 | — | — | US | disclosed |
| US-20040137364-A1 | Protective layers compatible with thick film pastes | E. I. DU PONT DE NEMOURS AND COMPANY | 2004-07-15 | — | — | US | disclosed |